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USPTO Patent Rankings Data through Dec 31, 2025
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Thomas Ivers — 11 Patents

IBM: 11 patents #10,022 of 70,183Top 15%
Wappingers Falls, NY: #183 of 884 inventorsTop 25%
New York: #13,476 of 115,490 inventorsTop 15%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Thomas Ivers has been granted 11 US patents while listed as an inventor at IBM. The first was granted in 2001 and the most recent in January 2009. Thomas Ivers ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Thomas Ivers in Wappingers Falls, NY, US.

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
7480990 Method of making conductor contacts having enhanced reliability John A. Fitzsimmons, William J. Cote, Nancy Anne Greco, Steven Moskowitz 2009-01-27 $4,993,000
7034400 Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors Edward Barth, Glenn A. Biery, Jeffrey P. Gambino, Hyun Koo Lee, Ernest N. Levine +2 more 2006-04-25 $9,745,000
6939797 Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Sarah L. Lane, Jia Lee +3 more 2005-09-06 $5,379,000
6821890 Method for improving adhesion to copper Vincent J. McGahay, Joyce C. Liu, Henry A. Nye, III 2004-11-23 $4,043,000
6737747 Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Sarah L. Lane, Jia Lee +3 more 2004-05-18 $9,414,000
6726996 Laminated diffusion barrier Edward Barth, Stephan A. Cohen, Chester T. Dziobkowski, John A. Fitzsimmons, Stephen M. Gates +3 more 2004-04-27 $8,134,000
6626188 Method for cleaning and preconditioning a chemical vapor deposition chamber dome John A. Fitzsimmons, Pavel Smetana 2003-09-30 $10,221,000
6500772 Methods and materials for depositing films on semiconductor substrates Ashima B. Chakravarti, Richard A. Conti, Chester T. Dziobkowski, Paul C. Jamison, Frank V. Liucci 2002-12-31 $15,139,000
6335261 Directional CVD process with optimized etchback Wesley C. Natzle, Richard A. Conti, Laertis Economikos, George D. Papasouliotis 2002-01-01
6271595 Method for improving adhesion to copper Vincent J. McGahay, Joyce C. Liu, Henry A. Nye, III 2001-08-07 $22,988,000
6252295 Adhesion of silicon carbide films Donna R. Cote, Daniel C. Edelstein, John A. Fitzsimmons, Paul C. Jamison, Ernest N. Levine 2001-06-26 $22,108,000