| 7480990 |
Method of making conductor contacts having enhanced reliability |
John A. Fitzsimmons, William J. Cote, Nancy Anne Greco, Steven Moskowitz |
2009-01-27 |
| 7034400 |
Dual damascene interconnect structure using low stress fluorosilicate insulator with copper conductors |
Edward Barth, Glenn A. Biery, Jeffrey P. Gambino, Hyun Koo Lee, Ernest N. Levine +2 more |
2006-04-25 |
| 6939797 |
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Sarah L. Lane, Jia Lee +3 more |
2005-09-06 |
| 6821890 |
Method for improving adhesion to copper |
Vincent J. McGahay, Joyce C. Liu, Henry A. Nye, III |
2004-11-23 |
| 6737747 |
Advanced BEOL interconnect structures with low-k PE CVD cap layer and method thereof |
Edward Barth, John A. Fitzsimmons, Stephen M. Gates, Sarah L. Lane, Jia Lee +3 more |
2004-05-18 |
| 6726996 |
Laminated diffusion barrier |
Edward Barth, Stephan A. Cohen, Chester T. Dziobkowski, John A. Fitzsimmons, Stephen M. Gates +3 more |
2004-04-27 |
| 6626188 |
Method for cleaning and preconditioning a chemical vapor deposition chamber dome |
John A. Fitzsimmons, Pavel Smetana |
2003-09-30 |
| 6500772 |
Methods and materials for depositing films on semiconductor substrates |
Ashima B. Chakravarti, Richard A. Conti, Chester T. Dziobkowski, Paul C. Jamison, Frank V. Liucci |
2002-12-31 |
| 6335261 |
Directional CVD process with optimized etchback |
Wesley C. Natzle, Richard A. Conti, Laertis Economikos, George D. Papasouliotis |
2002-01-01 |
| 6271595 |
Method for improving adhesion to copper |
Vincent J. McGahay, Joyce C. Liu, Henry A. Nye, III |
2001-08-07 |
| 6252295 |
Adhesion of silicon carbide films |
Donna R. Cote, Daniel C. Edelstein, John A. Fitzsimmons, Paul C. Jamison, Ernest N. Levine |
2001-06-26 |
