Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1009983 | Drum stick | — | 2024-01-02 |
| 10224242 | Low-resistivity metallic interconnect structures | Chih-Chao Yang | 2019-03-05 |
| 10204823 | Enhancing robustness of SOI substrate containing a buried N+ silicon layer for CMOS processing | Stephen W. Bedell, Joel P. de Souza, Karen A. Nummy, Daniel J. Poindexter, Devendra K. Sadana | 2019-02-12 |
| 9922866 | Enhancing robustness of SOI substrate containing a buried N+ silicon layer for CMOS processing | Stephen W. Bedell, Joel P. de Souza, Karen A. Nummy, Daniel J. Poindexter, Devendra K. Sadana | 2018-03-20 |
| 9698043 | Shallow trench isolation for semiconductor devices | Kevin K. Chan, Alfred Grill, Deborah A. Neumayer | 2017-07-04 |
| 9613900 | Nanoscale interconnect structure | Chih-Chao Yang, Eric G. Liniger | 2017-04-04 |
| D781371 | Drumstick grip pattern | — | 2017-03-14 |
| D779812 | Drumstick bag | — | 2017-02-28 |
| 9281211 | Nanoscale interconnect structure | Chih-Chao Yang, Eric G. Liniger | 2016-03-08 |
| 9006895 | Interconnect structures containing nitrided metallic residues | Chih-Chao Yang | 2015-04-14 |
| 8962479 | Interconnect structures containing nitrided metallic residues | Chih-Chao Yang | 2015-02-24 |
| 8536069 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Li-Qun Xia | 2013-09-17 |
| 8492880 | Multilayered low k cap with conformal gap fill and UV stable compressive stress properties | Mihaela Balseanu, Alfred Grill, Thomas J. Haigh, Jr., Son V. Nguyen, Li-Qun Xia | 2013-07-23 |
| 8362596 | Engineered interconnect dielectric caps having compressive stress and interconnect structures containing same | Alfred Grill, Thomas J. Haigh, Jr., Xiao Hu Liu, Son V. Nguyen, Thomas M. Shaw +1 more | 2013-01-29 |
| 7256146 | Method of forming a ceramic diffusion barrier layer | Stephen M. Gates, Jeffrey Hedrick, Elbert E. Huang, Dirk Pfeiffer | 2007-08-14 |
| 7252875 | Diffusion barrier with low dielectric constant and semiconductor device containing same | Stephen M. Gates, Alfred Grill, Vishnubhai V. Patel | 2007-08-07 |
| 7223670 | DUV laser annealing and stabilization of SiCOH films | Alessandro C. Callegari, Fuad E. Doany | 2007-05-29 |
| 7172968 | Ultra thin, single phase, diffusion barrier for metal conductors | Fenton R. McFeely, Cevdet I. Noyan, Kenneth P. Rodbell, Robert Rosenberg, John J. Yurkas | 2007-02-06 |
| 6940173 | Interconnect structures incorporating low-k dielectric barrier films | Stephen M. Gates, Jeffrey Hedrick, Elbert E. Huang, Dirk Pfeiffer | 2005-09-06 |
| 6784485 | Diffusion barrier layer and semiconductor device containing same | Timothy J. Dalton, John A. Fitzsimmons, Stephen M. Gates, Lynne M. Gignac, Paul C. Jamison +5 more | 2004-08-31 |
| 6730618 | Low k dielectric materials with inherent copper ion migration barrier | Claudius Feger, Jeffrey Hedrick, Jane M. Shaw | 2004-05-04 |
| 6726996 | Laminated diffusion barrier | Edward Barth, Chester T. Dziobkowski, John A. Fitzsimmons, Stephen M. Gates, Thomas Ivers +3 more | 2004-04-27 |
| 6577011 | Chip interconnect wiring structure with low dielectric constant insulator and methods for fabricating the same | Leena Paivikki Buchwalter, Alessandro C. Callegari, Teresita O. Graham, John P. Hummel, Christopher V. Jahnes +3 more | 2003-06-10 |
| 6559046 | Insulator for integrated circuits and process | Vincent J. McGahay, Ronald R. Uttecht | 2003-05-06 |
| 6452276 | Ultra thin, single phase, diffusion barrier for metal conductors | Fenton R. McFeely, Cevdet I. Noyan, Kenneth P. Rodbell, John J. Yurkas, Robert Rosenberg | 2002-09-17 |