| 10943863 |
Techniques to improve reliability in Cu interconnects using Cu intermetallics |
Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel |
2021-03-09 |
$4,710,000 |
| 10833025 |
Compressive zone to reduce dicing defects |
Kirk D. Peterson, Thomas A. Wassick, Nicolas Pizzuti |
2020-11-10 |
$848,000 |
| 10818590 |
Techniques to improve reliability in Cu interconnects using Cu intermetallics |
Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel |
2020-10-27 |
$6,165,000 |
| 10755404 |
Integrated circuit defect detection using pattern images |
Chung-Ching Lin, Peilin Song, Franco Stellari, Thomas A. Wassick |
2020-08-25 |
$2,454,000 |
| 10636750 |
Step pyramid shaped structure to reduce dicing defects |
Shidong Li, Kirk D. Peterson, Nicolas Pizzuti, Thomas A. Wassick |
2020-04-28 |
$4,123,000 |
| 10461026 |
Techniques to improve reliability in Cu interconnects using Cu intermetallics |
Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel |
2019-10-29 |
$4,364,000 |
| 10354824 |
Piezoelectronic switch device for RF applications |
Matthew W. Copel, Bruce G. Elmegreen, Glenn J. Martyna, Dennis M. Newns, Paul M. Solomon |
2019-07-16 |
$4,107,000 |
| 10203199 |
Strain monitoring of MRAM arrays |
Anthony J. Annunziata, Chandrasekharan Kothandaraman |
2019-02-12 |
$5,536,000 |
| 10168143 |
Strain monitoring of MRAM arrays |
Anthony J. Annunziata, Chandrasekharan Kothandaraman |
2019-01-01 |
|
| 9939486 |
Integrated time dependent dielectric breakdown reliability testing |
Jifeng Chen, Dirk Pfeiffer, Peilin Song, Franco Stellari |
2018-04-10 |
$2,135,000 |
| 9881759 |
Piezoelectronic switch device for RF applications |
Matthew W. Copel, Bruce G. Elmegreen, Glenn J. Martyna, Dennis M. Newns, Paul M. Solomon |
2018-01-30 |
$2,622,000 |
| 9874601 |
Integrated time dependent dielectric breakdown reliability testing |
Jifeng Chen, Dirk Pfeiffer, Peilin Song, Franco Stellari |
2018-01-23 |
$4,886,000 |
| 9738560 |
Controlling fragmentation of chemically strengthened glass |
Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang +3 more |
2017-08-22 |
$2,056,000 |
| 9586857 |
Controlling fragmentation of chemically strengthened glass |
Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang +3 more |
2017-03-07 |
$2,625,000 |
| 9583410 |
Volumetric integrated circuit and volumetric integrated circuit manufacturing method |
Daniel C. Edelstein, Michael A. Gaynes, Bucknell C. Webb, Roy R. Yu |
2017-02-28 |
$2,397,000 |
| 9557369 |
Integrated time dependent dielectric breakdown reliability testing |
Jifeng Chen, Dirk Pfeiffer, Peilin Song, Franco Stellari |
2017-01-31 |
$3,813,000 |
| 9472368 |
Piezoelectronic switch device for RF applications |
Matthew W. Copel, Bruce G. Elmegreen, Glenn J. Martyna, Dennis M. Newns, Paul M. Solomon |
2016-10-18 |
$1,445,000 |
| 9448277 |
Integrated time dependent dielectric breakdown reliability testing |
Jifeng Chen, Dirk Pfeiffer, Peilin Song, Franco Stellari |
2016-09-20 |
$4,565,000 |
| 9443776 |
Method and structure for determining thermal cycle reliability |
Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more |
2016-09-13 |
$3,651,000 |
| 9287186 |
Method and structure for determining thermal cycle reliability |
Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more |
2016-03-15 |
$907,000 |
| 9219037 |
Low k porous SiCOH dielectric and integration with post film formation treatment |
Stephen M. Gates, Alfred Grill, Son V. Nguyen, Satyanarayana V. Nitta |
2015-12-22 |
$977,000 |
| 9087805 |
Semiconductor test and monitoring structure to detect boundaries of safe effective modulus |
James V. Crain, Jr., Mark C. H. Lamorey, Christopher D. Muzzy, David B. Stone |
2015-07-21 |
$2,242,000 |
| 9082781 |
Semiconductor article having a zig-zag guard ring and method of forming the same |
Ronald G. Filippi, Erdem Kaltalioglu, Xiao Hu Liu, Ping-Chuan Wang, Bucknell C. Webb +1 more |
2015-07-14 |
$7,900,000 |
| 9059167 |
Structure and method for making crack stop for 3D integrated circuits |
Mukta G. Farooq, John A. Griesemer, William Francis Landers, Ian D. Melville, Huilong Zhu |
2015-06-16 |
$2,098,000 |
| 9018089 |
Multiple step anneal method and semiconductor formed by multiple step anneal |
Eric G. Liniger, Griselda Bonilla, Pak Leung, Stephen A. Cohen, Stephen M. Gates |
2015-04-28 |
$3,749,000 |
