Issued Patents All Time
Showing 25 most recent of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10943863 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel | 2021-03-09 |
| 10833025 | Compressive zone to reduce dicing defects | Kirk D. Peterson, Thomas A. Wassick, Nicolas Pizzuti | 2020-11-10 |
| 10818590 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel | 2020-10-27 |
| 10755404 | Integrated circuit defect detection using pattern images | Chung-Ching Lin, Peilin Song, Franco Stellari, Thomas A. Wassick | 2020-08-25 |
| 10636750 | Step pyramid shaped structure to reduce dicing defects | Shidong Li, Kirk D. Peterson, Nicolas Pizzuti, Thomas A. Wassick | 2020-04-28 |
| 10461026 | Techniques to improve reliability in Cu interconnects using Cu intermetallics | Chao-Kun Hu, Christian Lavoie, Stephen M. Rossnagel | 2019-10-29 |
| 10354824 | Piezoelectronic switch device for RF applications | Matthew W. Copel, Bruce G. Elmegreen, Glenn J. Martyna, Dennis M. Newns, Paul M. Solomon | 2019-07-16 |
| 10203199 | Strain monitoring of MRAM arrays | Anthony J. Annunziata, Chandrasekharan Kothandaraman | 2019-02-12 |
| 10168143 | Strain monitoring of MRAM arrays | Anthony J. Annunziata, Chandrasekharan Kothandaraman | 2019-01-01 |
| 9939486 | Integrated time dependent dielectric breakdown reliability testing | Jifeng Chen, Dirk Pfeiffer, Peilin Song, Franco Stellari | 2018-04-10 |
| 9881759 | Piezoelectronic switch device for RF applications | Matthew W. Copel, Bruce G. Elmegreen, Glenn J. Martyna, Dennis M. Newns, Paul M. Solomon | 2018-01-30 |
| 9874601 | Integrated time dependent dielectric breakdown reliability testing | Jifeng Chen, Dirk Pfeiffer, Peilin Song, Franco Stellari | 2018-01-23 |
| 9738560 | Controlling fragmentation of chemically strengthened glass | Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang +3 more | 2017-08-22 |
| 9586857 | Controlling fragmentation of chemically strengthened glass | Cyril Cabral, Jr., Fuad E. Doany, Gregory M. Fritz, Michael S. Gordon, Qiang Huang +3 more | 2017-03-07 |
| 9583410 | Volumetric integrated circuit and volumetric integrated circuit manufacturing method | Daniel C. Edelstein, Michael A. Gaynes, Bucknell C. Webb, Roy R. Yu | 2017-02-28 |
| 9557369 | Integrated time dependent dielectric breakdown reliability testing | Jifeng Chen, Dirk Pfeiffer, Peilin Song, Franco Stellari | 2017-01-31 |
| 9472368 | Piezoelectronic switch device for RF applications | Matthew W. Copel, Bruce G. Elmegreen, Glenn J. Martyna, Dennis M. Newns, Paul M. Solomon | 2016-10-18 |
| 9448277 | Integrated time dependent dielectric breakdown reliability testing | Jifeng Chen, Dirk Pfeiffer, Peilin Song, Franco Stellari | 2016-09-20 |
| 9443776 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2016-09-13 |
| 9287186 | Method and structure for determining thermal cycle reliability | Ronald G. Filippi, Jason P. Gill, Vincent J. McGahay, Paul S. McLaughlin, Conal E. Murray +2 more | 2016-03-15 |
| 9219037 | Low k porous SiCOH dielectric and integration with post film formation treatment | Stephen M. Gates, Alfred Grill, Son V. Nguyen, Satyanarayana V. Nitta | 2015-12-22 |
| 9087805 | Semiconductor test and monitoring structure to detect boundaries of safe effective modulus | James V. Crain, Jr., Mark C. H. Lamorey, Christopher D. Muzzy, David B. Stone | 2015-07-21 |
| 9082781 | Semiconductor article having a zig-zag guard ring and method of forming the same | Ronald G. Filippi, Erdem Kaltalioglu, Xiao Hu Liu, Ping-Chuan Wang, Bucknell C. Webb +1 more | 2015-07-14 |
| 9059167 | Structure and method for making crack stop for 3D integrated circuits | Mukta G. Farooq, John A. Griesemer, William Francis Landers, Ian D. Melville, Huilong Zhu | 2015-06-16 |
| 9018089 | Multiple step anneal method and semiconductor formed by multiple step anneal | Eric G. Liniger, Griselda Bonilla, Pak Leung, Stephen A. Cohen, Stephen M. Gates | 2015-04-28 |