| 11270964 |
Mixed UBM and mixed pitch on a single die |
Charles L. Arvin |
2022-03-08 |
$4,244,000 |
| 11043468 |
Lead-free solder joining of electronic structures |
Charles L. Arvin, Clement Fortin, Thomas A. Wassick |
2021-06-22 |
$6,016,000 |
| 10950573 |
Lead-free column interconnect |
Charles L. Arvin, Clement Fortin, Krishna R. Tunga, Thomas Weiss |
2021-03-16 |
$6,230,000 |
| 10818623 |
Mixed UBM and mixed pitch on a single die |
Charles L. Arvin |
2020-10-27 |
$6,165,000 |
| 10804241 |
Non-porous copper to copper interconnect |
Charles L. Arvin |
2020-10-13 |
$4,674,000 |
| 10790253 |
Conductive pillar shaped for solder confinement |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2020-09-29 |
$6,035,000 |
| 10615137 |
Corrosion resistant aluminum bond pad structure |
Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Wolfgang Sauter |
2020-04-07 |
$1,846,000 |
| 10600751 |
Conductive pillar shaped for solder confinement |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2020-03-24 |
$1,716,000 |
| 10590561 |
Continuous modification of organics in chemical baths |
Charles L. Arvin |
2020-03-17 |
$1,423,000 |
| 10586782 |
Lead-free solder joining of electronic structures |
Charles L. Arvin, Clement Fortin, Brian W. Quinlan, Thomas A. Wassick, Thomas Weiss |
2020-03-10 |
$1,254,000 |
| 10570527 |
Continuous modification of organics in chemical baths |
Charles L. Arvin |
2020-02-25 |
$1,919,000 |
| 10553555 |
Non-porous copper to copper interconnect |
Charles L. Arvin |
2020-02-04 |
$2,135,000 |
| 10409006 |
Photonics chip |
Jeffrey P. Gambino, Wolfgang Sauter, Charles L. Arvin, Robert K. Leidy |
2019-09-10 |
$36,532,000 |
| 10290599 |
Conductive pillar shaped for solder confinement |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2019-05-14 |
$3,761,000 |
| 10249586 |
Mixed UBM and mixed pitch on a single die |
Charles L. Arvin |
2019-04-02 |
$2,364,000 |
| 10204877 |
Corrosion resistant aluminum bond pad structure |
Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Wolfgang Sauter |
2019-02-12 |
$5,536,000 |
| 10192839 |
Conductive pillar shaped for solder confinement |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2019-01-29 |
$19,198,000 |
| 10170446 |
Structures and methods to enable a full intermetallic interconnect |
Charles L. Arvin, Wolfgang Sauter |
2019-01-01 |
|
| 10068864 |
Nanowires for pillar interconnects |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2018-09-04 |
$2,923,000 |
| 10049897 |
Extrusion-resistant solder interconnect structures and methods of forming |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan |
2018-08-14 |
$10,336,000 |
| 9953940 |
Corrosion resistant aluminum bond pad structure |
Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Wolfgang Sauter |
2018-04-24 |
$2,845,000 |
| 9947598 |
Determining crackstop strength of integrated circuit assembly at the wafer level |
Krishna R. Tunga, Karen P. McLaughlin, Charles L. Arvin, Brian R. Sundlof, Steven P. Ostrander +1 more |
2018-04-17 |
$1,989,000 |
| 9933577 |
Photonics chip |
Jeffery P. GAMBINO, Wolfgang Sauter, Charles L. Arvin, Robert K. Leidy |
2018-04-03 |
$14,738,000 |
| 9911708 |
Conductive pillar shaped for solder confinement |
Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter |
2018-03-06 |
$2,330,000 |
| 9911711 |
Structures and methods to enable a full intermetallic interconnect |
Charles L. Arvin, Wolfgang Sauter |
2018-03-06 |
$2,330,000 |
