Issued Patents All Time
Showing 25 most recent of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270964 | Mixed UBM and mixed pitch on a single die | Charles L. Arvin | 2022-03-08 |
| 11043468 | Lead-free solder joining of electronic structures | Charles L. Arvin, Clement Fortin, Thomas A. Wassick | 2021-06-22 |
| 10950573 | Lead-free column interconnect | Charles L. Arvin, Clement Fortin, Krishna R. Tunga, Thomas Weiss | 2021-03-16 |
| 10818623 | Mixed UBM and mixed pitch on a single die | Charles L. Arvin | 2020-10-27 |
| 10804241 | Non-porous copper to copper interconnect | Charles L. Arvin | 2020-10-13 |
| 10790253 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter | 2020-09-29 |
| 10615137 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Wolfgang Sauter | 2020-04-07 |
| 10600751 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter | 2020-03-24 |
| 10590561 | Continuous modification of organics in chemical baths | Charles L. Arvin | 2020-03-17 |
| 10586782 | Lead-free solder joining of electronic structures | Charles L. Arvin, Clement Fortin, Brian W. Quinlan, Thomas A. Wassick, Thomas Weiss | 2020-03-10 |
| 10570527 | Continuous modification of organics in chemical baths | Charles L. Arvin | 2020-02-25 |
| 10553555 | Non-porous copper to copper interconnect | Charles L. Arvin | 2020-02-04 |
| 10409006 | Photonics chip | Jeffrey P. Gambino, Wolfgang Sauter, Charles L. Arvin, Robert K. Leidy | 2019-09-10 |
| 10290599 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter | 2019-05-14 |
| 10249586 | Mixed UBM and mixed pitch on a single die | Charles L. Arvin | 2019-04-02 |
| 10204877 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Wolfgang Sauter | 2019-02-12 |
| 10192839 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter | 2019-01-29 |
| 10170446 | Structures and methods to enable a full intermetallic interconnect | Charles L. Arvin, Wolfgang Sauter | 2019-01-01 |
| 10068864 | Nanowires for pillar interconnects | Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter | 2018-09-04 |
| 10049897 | Extrusion-resistant solder interconnect structures and methods of forming | Timothy H. Daubenspeck, Jeffrey P. Gambino, Wolfgang Sauter, Timothy D. Sullivan | 2018-08-14 |
| 9953940 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Wolfgang Sauter | 2018-04-24 |
| 9947598 | Determining crackstop strength of integrated circuit assembly at the wafer level | Krishna R. Tunga, Karen P. McLaughlin, Charles L. Arvin, Brian R. Sundlof, Steven P. Ostrander +1 more | 2018-04-17 |
| 9933577 | Photonics chip | Jeffery P. GAMBINO, Wolfgang Sauter, Charles L. Arvin, Robert K. Leidy | 2018-04-03 |
| 9911708 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Wolfgang Sauter | 2018-03-06 |
| 9911711 | Structures and methods to enable a full intermetallic interconnect | Charles L. Arvin, Wolfgang Sauter | 2018-03-06 |