Issued Patents All Time
Showing 1–25 of 163 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12095494 | Lateral escape using triangular structure of transceivers | Aatreya Chakravarti, Mark W. Kuemerle, Eric W. Tremble | 2024-09-17 |
| 11282806 | Partitioned substrates with interconnect bridge | Mark W. Kuemerle, Eric W. Tremble | 2022-03-22 |
| 10790253 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2020-09-29 |
| 10748852 | Multi-chip module (MCM) with chip-to-chip connection redundancy and method | Mark W. Kuemerle, Edmund Blackshear | 2020-08-18 |
| 10714411 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Mark W. Kuemerle, Eric W. Tremble, David B. Stone, Nicholas A. Polomoff, Eric S. Parent +2 more | 2020-07-14 |
| 10615137 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy | 2020-04-07 |
| 10600751 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2020-03-24 |
| 10483233 | Split ball grid array pad for multi-chip modules | Anson J. Call, Erwin B. Cohen, Dany Minier, David B. Stone, Eric W. Tremble | 2019-11-19 |
| 10409006 | Photonics chip | Jeffrey P. Gambino, Christopher D. Muzzy, Charles L. Arvin, Robert K. Leidy | 2019-09-10 |
| 10290599 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2019-05-14 |
| 10204877 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy | 2019-02-12 |
| 10192839 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2019-01-29 |
| 10170446 | Structures and methods to enable a full intermetallic interconnect | Charles L. Arvin, Christopher D. Muzzy | 2019-01-01 |
| 10068864 | Nanowires for pillar interconnects | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2018-09-04 |
| 10049897 | Extrusion-resistant solder interconnect structures and methods of forming | Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, Timothy D. Sullivan | 2018-08-14 |
| 9953940 | Corrosion resistant aluminum bond pad structure | Charles L. Arvin, Jeffrey P. Gambino, Charles F. Musante, Christopher D. Muzzy | 2018-04-24 |
| 9933577 | Photonics chip | Jeffery P. GAMBINO, Christopher D. Muzzy, Charles L. Arvin, Robert K. Leidy | 2018-04-03 |
| 9911711 | Structures and methods to enable a full intermetallic interconnect | Charles L. Arvin, Christopher D. Muzzy | 2018-03-06 |
| 9911708 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2018-03-06 |
| 9875956 | Integrated interface structure | Mark W. Kuemerle, Daniel P. Greenberg, Eric W. Tremble | 2018-01-23 |
| 9798088 | Barrier structures for underfill blockout regions | Jeffrey P. Gambino, Robert K. Leidy, Christopher D. Muzzy, Eric Turcotte, Thomas E. Lombardi | 2017-10-24 |
| 9741682 | Structures to enable a full intermetallic interconnect | Charles L. Arvin, Christopher D. Muzzy | 2017-08-22 |
| 9679806 | Nanowires for pillar interconnects | Charles L. Arvin, Jeffrey P. Gambino, Christopher D. Muzzy | 2017-06-13 |
| 9633962 | Plug via formation with grid features in the passivation layer | Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy | 2017-04-25 |
| 9633914 | Split ball grid array pad for multi-chip modules | Anson J. Call, Erwin B. Cohen, Dany Minier, David B. Stone, Eric W. Tremble | 2017-04-25 |