Issued Patents All Time
Showing 25 most recent of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049819 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2021-06-29 |
| 10714411 | Interconnected integrated circuit (IC) chip structure and packaging and method of forming same | Wolfgang Sauter, Mark W. Kuemerle, Eric W. Tremble, Nicholas A. Polomoff, Eric S. Parent +2 more | 2020-07-14 |
| 10685919 | Reduced-warpage laminate structure | Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell +1 more | 2020-06-16 |
| 10566300 | Bond pads with surrounding fill lines | Scott K. Pozder, Thiagarajan Raman, Kristina Young-Fisher | 2020-02-18 |
| 10553544 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2020-02-04 |
| 10483233 | Split ball grid array pad for multi-chip modules | Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, Eric W. Tremble | 2019-11-19 |
| 10214929 | Floating swimming pool cover | — | 2019-02-26 |
| 9935058 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2018-04-03 |
| 9633914 | Split ball grid array pad for multi-chip modules | Anson J. Call, Erwin B. Cohen, Dany Minier, Wolfgang Sauter, Eric W. Tremble | 2017-04-25 |
| 9634163 | Lateral collection photovoltaics | Stephen J. Fonash, Handong Li | 2017-04-25 |
| 9613915 | Reduced-warpage laminate structure | Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell +1 more | 2017-04-04 |
| 9599664 | Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures | Luke D. LaCroix, Mark C. Lamorey, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr +1 more | 2017-03-21 |
| 9543254 | Chamfered corner crackstop for an integrated circuit chip | Mark C. Lamorey | 2017-01-10 |
| 9543255 | Reduced-warpage laminate structure | Mark C. Lamorey, Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell +1 more | 2017-01-10 |
| 9531209 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2016-12-27 |
| 9463855 | Propulsion device for sailboat | — | 2016-10-11 |
| 9252101 | Packages for three-dimensional die stacks | Mark C. H. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2016-02-02 |
| 9245854 | Organic module EMI shielding structures and methods | William L. Brodsky, Timothy W. Budell, Samuel R. Connor, Mark C. Lamorey, Janak G. Patel +1 more | 2016-01-26 |
| 9245083 | Method, structures and method of designing reduced delamination integrated circuits | Mark C. Lamorey | 2016-01-26 |
| 9209141 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2015-12-08 |
| 9190399 | Thermally enhanced three-dimensional integrated circuit package | Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2015-11-17 |
| 9185807 | Integrated circuit structures having off-axis in-hole capacitor | Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2015-11-10 |
| 9093445 | Packaging identical chips in a stacked structure | Evan G. Colgan, Luke D. LaCroix, Mark C. H. Lamorey | 2015-07-28 |
| 9087805 | Semiconductor test and monitoring structure to detect boundaries of safe effective modulus | James V. Crain, Jr., Mark C. H. Lamorey, Christopher D. Muzzy, Thomas M. Shaw | 2015-07-21 |
| 9078373 | Integrated circuit structures having off-axis in-hole capacitor and methods of forming | Mark C. Lamorey, Janak G. Patel, Peter Slota, Jr. | 2015-07-07 |