| 11049819 |
Shielded package assemblies with integrated capacitor |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2021-06-29 |
$5,149,000 |
| 10685919 |
Reduced-warpage laminate structure |
Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more |
2020-06-16 |
$3,682,000 |
| 10553544 |
Shielded package assemblies with integrated capacitor |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2020-02-04 |
$2,135,000 |
| 9935058 |
Shielded package assemblies with integrated capacitor |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2018-04-03 |
$2,801,000 |
| 9613915 |
Reduced-warpage laminate structure |
Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more |
2017-04-04 |
$2,713,000 |
| 9599664 |
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures |
Luke D. LaCroix, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr, Peter Slota, Jr. +1 more |
2017-03-21 |
$11,989,000 |
| 9543255 |
Reduced-warpage laminate structure |
Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more |
2017-01-10 |
$4,562,000 |
| 9543254 |
Chamfered corner crackstop for an integrated circuit chip |
David B. Stone |
2017-01-10 |
$8,696,000 |
| 9531209 |
Shielded package assemblies with integrated capacitor |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2016-12-27 |
$3,909,000 |
| 9245854 |
Organic module EMI shielding structures and methods |
William L. Brodsky, Timothy W. Budell, Samuel R. Connor, Janak G. Patel, Peter Slota, Jr. +1 more |
2016-01-26 |
$652,000 |
| 9245083 |
Method, structures and method of designing reduced delamination integrated circuits |
David B. Stone |
2016-01-26 |
$652,000 |
| 9209141 |
Shielded package assemblies with integrated capacitor |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2015-12-08 |
$3,322,000 |
| 9190399 |
Thermally enhanced three-dimensional integrated circuit package |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2015-11-17 |
$3,493,000 |
| 9185807 |
Integrated circuit structures having off-axis in-hole capacitor |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2015-11-10 |
|
| 9078373 |
Integrated circuit structures having off-axis in-hole capacitor and methods of forming |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2015-07-07 |
$5,899,000 |
| 9057760 |
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures |
Luke D. LaCroix, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr, Peter Slota, Jr. +1 more |
2015-06-16 |
$2,098,000 |
| 9059127 |
Packages for three-dimensional die stacks |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2015-06-16 |
$2,098,000 |
| 9059191 |
Chamfered corner crackstop for an integrated circuit chip |
David B. Stone |
2015-06-16 |
$2,098,000 |
| 9018040 |
Power distribution for 3D semiconductor package |
Janak G. Patel, Peter Slota, Jr., David B. Stone |
2015-04-28 |
$3,749,000 |
| 8999846 |
Elongated via structures |
Luke D. LaCroix, Janak G. Patel, Peter Slota, Jr., David B. Stone |
2015-04-07 |
$3,806,000 |
| 8952503 |
Organic module EMI shielding structures and methods |
William L. Brodsky, Timothy W. Budell, Samuel R. Connor, Janak G. Patel, Peter Slota, Jr. +1 more |
2015-02-10 |
$3,717,000 |
| 8759977 |
Elongated via structures |
Luke D. LaCroix, Janak G. Patel, Peter Slota, Jr., David B. Stone |
2014-06-24 |
$6,231,000 |
| 8653662 |
Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits |
Luke D. LaCroix, Janak G. Patel, Peter Slota, Jr., David B. Stone |
2014-02-18 |
$4,910,000 |
| 7505337 |
Method and apparatus for repairing a shorted tunnel device |
Janusz J. Nowak, Yu Lu |
2009-03-17 |
$4,806,000 |
| 7352639 |
Method and apparatus for increasing yield in a memory circuit |
Yu Lu, Janusz J. Nowak |
2008-04-01 |
$7,825,000 |
