Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11049819 | Shielded package assemblies with integrated capacitor | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2021-06-29 |
| 10685919 | Reduced-warpage laminate structure | Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more | 2020-06-16 |
| 10553544 | Shielded package assemblies with integrated capacitor | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2020-02-04 |
| 9935058 | Shielded package assemblies with integrated capacitor | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2018-04-03 |
| 9613915 | Reduced-warpage laminate structure | Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more | 2017-04-04 |
| 9599664 | Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures | Luke D. LaCroix, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr, Peter Slota, Jr. +1 more | 2017-03-21 |
| 9543255 | Reduced-warpage laminate structure | Shidong Li, Janak G. Patel, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more | 2017-01-10 |
| 9543254 | Chamfered corner crackstop for an integrated circuit chip | David B. Stone | 2017-01-10 |
| 9531209 | Shielded package assemblies with integrated capacitor | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2016-12-27 |
| 9245854 | Organic module EMI shielding structures and methods | William L. Brodsky, Timothy W. Budell, Samuel R. Connor, Janak G. Patel, Peter Slota, Jr. +1 more | 2016-01-26 |
| 9245083 | Method, structures and method of designing reduced delamination integrated circuits | David B. Stone | 2016-01-26 |
| 9209141 | Shielded package assemblies with integrated capacitor | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2015-12-08 |
| 9190399 | Thermally enhanced three-dimensional integrated circuit package | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2015-11-17 |
| 9185807 | Integrated circuit structures having off-axis in-hole capacitor | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2015-11-10 |
| 9078373 | Integrated circuit structures having off-axis in-hole capacitor and methods of forming | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2015-07-07 |
| 9057760 | Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures | Luke D. LaCroix, Steven F. Oakland, Janak G. Patel, Kerry P. Pfarr, Peter Slota, Jr. +1 more | 2015-06-16 |
| 9059127 | Packages for three-dimensional die stacks | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2015-06-16 |
| 9059191 | Chamfered corner crackstop for an integrated circuit chip | David B. Stone | 2015-06-16 |
| 9018040 | Power distribution for 3D semiconductor package | Janak G. Patel, Peter Slota, Jr., David B. Stone | 2015-04-28 |
| 8999846 | Elongated via structures | Luke D. LaCroix, Janak G. Patel, Peter Slota, Jr., David B. Stone | 2015-04-07 |
| 8952503 | Organic module EMI shielding structures and methods | William L. Brodsky, Timothy W. Budell, Samuel R. Connor, Janak G. Patel, Peter Slota, Jr. +1 more | 2015-02-10 |
| 8759977 | Elongated via structures | Luke D. LaCroix, Janak G. Patel, Peter Slota, Jr., David B. Stone | 2014-06-24 |
| 8653662 | Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits | Luke D. LaCroix, Janak G. Patel, Peter Slota, Jr., David B. Stone | 2014-02-18 |
| 7505337 | Method and apparatus for repairing a shorted tunnel device | Janusz J. Nowak, Yu Lu | 2009-03-17 |
| 7352639 | Method and apparatus for increasing yield in a memory circuit | Yu Lu, Janusz J. Nowak | 2008-04-01 |