Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810832 | Heat sink configuration for multi-chip module | Richard S. Graf, Manish Nayini, Nazmul Habib | 2023-11-07 |
| 11682646 | IC chip package with dummy solder structure under corner, and related method | Manish Nayini, Richard S. Graf, Nazmul Habib | 2023-06-20 |
| 11171104 | IC chip package with dummy solder structure under corner, and related method | Manish Nayini, Richard S. Graf, Nazmul Habib | 2021-11-09 |
| 11049819 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2021-06-29 |
| 10685919 | Reduced-warpage laminate structure | Mark C. Lamorey, Shidong Li, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more | 2020-06-16 |
| 10553544 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2020-02-04 |
| 10461067 | Thermally enhanced package to reduce thermal interaction between dies | Subramanian S. Iyer, Daniel G. Berger | 2019-10-29 |
| 10342160 | Heat sink attachment on existing heat sinks | Louis-Marie Achard, Kenneth C. Marston, David L. Questad | 2019-07-02 |
| 10224262 | Flexible heat spreader lid | Kathryn C. Rivera, David Stone, Samantha Donovan | 2019-03-05 |
| 9935058 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2018-04-03 |
| 9883612 | Heat sink attachment on existing heat sinks | Louis-Marie Achard, Kenneth C. Marston, David L. Questad | 2018-01-30 |
| 9859262 | Thermally enhanced package to reduce thermal interaction between dies | Subramanian S. Iyer, Daniel G. Berger | 2018-01-02 |
| 9613915 | Reduced-warpage laminate structure | Mark C. Lamorey, Shidong Li, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more | 2017-04-04 |
| 9599664 | Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures | Luke D. LaCroix, Mark C. Lamorey, Steven F. Oakland, Kerry P. Pfarr, Peter Slota, Jr. +1 more | 2017-03-21 |
| 9543255 | Reduced-warpage laminate structure | Mark C. Lamorey, Shidong Li, Douglas O. Powell, David J. Russell, Peter Slota, Jr. +1 more | 2017-01-10 |
| 9531209 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2016-12-27 |
| 9252101 | Packages for three-dimensional die stacks | Mark C. H. Lamorey, Peter Slota, Jr., David B. Stone | 2016-02-02 |
| 9245854 | Organic module EMI shielding structures and methods | William L. Brodsky, Timothy W. Budell, Samuel R. Connor, Mark C. Lamorey, Peter Slota, Jr. +1 more | 2016-01-26 |
| 9209141 | Shielded package assemblies with integrated capacitor | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2015-12-08 |
| 9190399 | Thermally enhanced three-dimensional integrated circuit package | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2015-11-17 |
| 9185807 | Integrated circuit structures having off-axis in-hole capacitor | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2015-11-10 |
| 9078373 | Integrated circuit structures having off-axis in-hole capacitor and methods of forming | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2015-07-07 |
| 9059127 | Packages for three-dimensional die stacks | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2015-06-16 |
| 9057760 | Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures | Luke D. LaCroix, Mark C. Lamorey, Steven F. Oakland, Kerry P. Pfarr, Peter Slota, Jr. +1 more | 2015-06-16 |
| 9018040 | Power distribution for 3D semiconductor package | Mark C. Lamorey, Peter Slota, Jr., David B. Stone | 2015-04-28 |