Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818570 | Stacked semiconductor devices having dissimilar-sized dies | Luke England | 2020-10-27 |
| 10613754 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2020-04-07 |
| 10503402 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2019-12-10 |
| 10461067 | Thermally enhanced package to reduce thermal interaction between dies | Janak G. Patel, Subramanian S. Iyer | 2019-10-29 |
| 9886193 | Architecture and implementation of cortical system, and fabricating an architecture using 3D wafer scale integration | Troy L. Graves-Abe, Subramanian S. Iyer, Toshiaki Kirihata, Arvind Kumar, Winfried W. Wilcke | 2018-02-06 |
| 9859262 | Thermally enhanced package to reduce thermal interaction between dies | Janak G. Patel, Subramanian S. Iyer | 2018-01-02 |
| 7405247 | Conductive adhesive composition | Krishna G. Sachdev, Kelly Chioujones, Glenn G. Daves, Hilton T. Toy | 2008-07-29 |
| 7393419 | Conductive adhesive rework method | Krishna G. Sachdev, Kelly Chioujones, Glenn G. Daves, Hilton T. Toy | 2008-07-01 |
| 7329439 | UV-curable solvent free compositions and use thereof in ceramic chip defect repair | Krishna G. Sachdev, Kelly Chioujones, Brian W. Quinlan | 2008-02-12 |
| 7312261 | Thermal interface adhesive and rework | Krishna G. Sachdev, Kelly Chioujones, Glenn G. Daves, Hilton T. Toy | 2007-12-25 |
| 7255153 | High performance integrated MLC cooling device for high power density ICS and method for manufacturing | Raschid J. Bezama, Lester W. Herron, Bruno Michel, Govindarajan Natarajan | 2007-08-14 |
| 6838009 | Rework method for finishing metallurgy on chip carriers | Charles L. Arvin, Hsichang Liu, Krystyna W. Semkow | 2005-01-04 |
| 6529021 | Self-scrub buckling beam probe | Yuet-Ying Yu, Camille P. Bowne, Scott I. Langenthal, Charles H. Perry, Terence W. Spoor +1 more | 2003-03-04 |
| 6528145 | Polymer and ceramic composite electronic substrates | Shaji Farooq, Lester W. Herron, James N. Humenik, John U. Knickerbocker, Robert W. Pasco +2 more | 2003-03-04 |
| 6340630 | Method for making interconnect for low temperature chip attachment | Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more | 2002-01-22 |
| 6149122 | Method for building interconnect structures by injection molded solder and structures built | Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more | 2000-11-21 |
| 6133633 | Method for building interconnect structures by injection molded solder and structures built | Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more | 2000-10-17 |
| 6127735 | Interconnect for low temperature chip attachment | Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more | 2000-10-03 |
| 6020750 | Wafer test and burn-in platform using ceramic tile supports | James N. Humenik, Mark R. LaForce, Charles H. Perry | 2000-02-01 |
| 5775569 | Method for building interconnect structures by injection molded solder and structures built | Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more | 1998-07-07 |
| 5310625 | Process for forming negative tone images of polyimides using base treatment of crosslinked polyamic ester | Marie Angelopoulos, Jeffrey W. Labadie, Eric D. Perfecto, Martha I. Sanchez, Sally A. Swanson +1 more | 1994-05-10 |
| 5300403 | Line width control in a radiation sensitive polyimide | Marie Angelopolus, Eric D. Perfecto, Peter J. Wilkens | 1994-04-05 |
| 5209817 | Selective plating method for forming integral via and wiring layers | Umar M. Ahmad, Ananda H. Kumar, Susan J. LaMaire, Keshav Prasad, Sudipta K. Ray +1 more | 1993-05-11 |