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Thermally enhanced package to reduce thermal interaction between dies |
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2018-01-02 |
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Conductive adhesive composition |
Krishna G. Sachdev, Kelly Chioujones, Glenn G. Daves, Hilton T. Toy |
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Conductive adhesive rework method |
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UV-curable solvent free compositions and use thereof in ceramic chip defect repair |
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2008-02-12 |
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Thermal interface adhesive and rework |
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High performance integrated MLC cooling device for high power density ICS and method for manufacturing |
Raschid J. Bezama, Lester W. Herron, Bruno Michel, Govindarajan Natarajan |
2007-08-14 |
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Rework method for finishing metallurgy on chip carriers |
Charles L. Arvin, Hsichang Liu, Krystyna W. Semkow |
2005-01-04 |
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Self-scrub buckling beam probe |
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Polymer and ceramic composite electronic substrates |
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Interconnect for low temperature chip attachment |
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Wafer test and burn-in platform using ceramic tile supports |
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Method for building interconnect structures by injection molded solder and structures built |
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Process for forming negative tone images of polyimides using base treatment of crosslinked polyamic ester |
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Line width control in a radiation sensitive polyimide |
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1994-04-05 |
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Selective plating method for forming integral via and wiring layers |
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