Issued Patents All Time
Showing 25 most recent of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12300615 | Infrared debond damage mitigation by copper fill pattern | Mukta G. Farooq, Qianwen Chen, Shahid Butt, Michael P. Belyansky, Katsuyuki Sakuma +1 more | 2025-05-13 |
| 10438894 | Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices | Mukta G. Farooq, Koushik Ramachandran, Ian D. Melville | 2019-10-08 |
| 10041183 | Electrodeposition systems and methods that minimize anode and/or plating solution degradation | Charles L. Arvin, Harry D. Cox | 2018-08-07 |
| 10002835 | Structure for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma | 2018-06-19 |
| 9853006 | Semiconductor device contact structure having stacked nickel, copper, and tin layers | Charles L. Arvin, Harry D. Cox, Thomas A. Wassick | 2017-12-26 |
| 9728440 | Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer | Charles L. Arvin, Harry D. Cox, Brian M. Erwin, Jorge A. Lubguban, Jennifer D. Schuler | 2017-08-08 |
| 9689084 | Electrodeposition systems and methods that minimize anode and/or plating solution degradation | Charles L. Arvin, Harry D. Cox | 2017-06-27 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma | 2017-03-28 |
| 9576922 | Silver alloying post-chip join | Thomas J. Brunschwiler, Jonas Zuercher | 2017-02-21 |
| 9396991 | Multilayered contact structure having nickel, copper, and nickel-iron layers | Charles L. Arvin, Harry D. Cox, Thomas A. Wassick | 2016-07-19 |
| 9379007 | Electromigration-resistant lead-free solder interconnect structures | Charles L. Arvin, KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu +4 more | 2016-06-28 |
| 9343420 | Universal solder joints for 3D packaging | Brian M. Erwin, Nicholas A. Polomoff, Jae-Woong Nah | 2016-05-17 |
| 9324669 | Use of electrolytic plating to control solder wetting | Charles L. Arvin, Brian M. Erwin, Wolfgang Sauter | 2016-04-26 |
| 9190376 | Organic coating to inhibit solder wetting on pillar sidewalls | Charles L. Arvin, Brian M. Erwin, Wolfgang Sauter, Thomas A. Wassick | 2015-11-17 |
| 9177928 | Contact and solder ball interconnect | Charles L. Arvin, Wolfgang Sauter | 2015-11-03 |
| 9142501 | Under ball metallurgy (UBM) for improved electromigration | Charles L. Arvin, Minhua Lu, David J. Russell, Wolfgang Sauter, Krystyna W. Semkow +1 more | 2015-09-22 |
| 9084378 | Under ball metallurgy (UBM) for improved electromigration | Charles L. Arvin, Minhua Lu, Krystyna W. Semkow, Thomas A. Wassick | 2015-07-14 |
| 8937009 | Far back end of the line metallization method and structures | Timothy H. Daubenspeck, Jeffrey P. Gambino, Karen P. McLaughlin, Ekta Misra, Christopher D. Muzzy +1 more | 2015-01-20 |
| 8910853 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2014-12-16 |
| 8820612 | Injection molded solder process for forming solder bumps on substrates | Claudius Feger, Mark H. McLeod, Jae-Woong Nah | 2014-09-02 |
| 8742578 | Solder volume compensation with C4 process | Charles L. Arvin, Wolfgang Sauter, Jennifer D. Schuler | 2014-06-03 |
| 8518741 | Wafer-to-wafer process for manufacturing a stacked structure | Minhua Lu | 2013-08-27 |
| 8496159 | Injection molded solder process for forming solder bumps on substrates | Claudius Feger, Mark H. McLeod, Jae-Woong Nah | 2013-07-30 |
| 8493746 | Additives for grain fragmentation in Pb-free Sn-based solder | Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more | 2013-07-23 |
| 8466543 | Three dimensional stacked package structure | Thomas J. Fleischman, Sudipta K. Ray | 2013-06-18 |