| 12469787 |
Resist patterned redistribution wiring on copper polyimide via layer |
Mukta G. Farooq, James H. Kelly, Spyridon Skordas, Dale Curtis McHerron |
2025-11-11 |
|
| 12300615 |
Infrared debond damage mitigation by copper fill pattern |
Mukta G. Farooq, Qianwen Chen, Shahid Butt, Michael P. Belyansky, Katsuyuki Sakuma +1 more |
2025-05-13 |
|
| 10438894 |
Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices |
Mukta G. Farooq, Koushik Ramachandran, Ian D. Melville |
2019-10-08 |
$23,319,000 |
| 10041183 |
Electrodeposition systems and methods that minimize anode and/or plating solution degradation |
Charles L. Arvin, Harry D. Cox |
2018-08-07 |
$10,289,000 |
| 10002835 |
Structure for establishing interconnects in packages using thin interposers |
Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma |
2018-06-19 |
$20,071,000 |
| 9853006 |
Semiconductor device contact structure having stacked nickel, copper, and tin layers |
Charles L. Arvin, Harry D. Cox, Thomas A. Wassick |
2017-12-26 |
$7,266,000 |
| 9728440 |
Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer |
Charles L. Arvin, Harry D. Cox, Brian M. Erwin, Jorge A. Lubguban, Jennifer D. Schuler |
2017-08-08 |
$10,842,000 |
| 9689084 |
Electrodeposition systems and methods that minimize anode and/or plating solution degradation |
Charles L. Arvin, Harry D. Cox |
2017-06-27 |
|
| 9607973 |
Method for establishing interconnects in packages using thin interposers |
Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Harry D. Cox, Katsuyuki Sakuma |
2017-03-28 |
$13,638,000 |
| 9576922 |
Silver alloying post-chip join |
Thomas J. Brunschwiler, Jonas Zuercher |
2017-02-21 |
$8,671,000 |
| 9396991 |
Multilayered contact structure having nickel, copper, and nickel-iron layers |
Charles L. Arvin, Harry D. Cox, Thomas A. Wassick |
2016-07-19 |
$2,452,000 |
| 9379007 |
Electromigration-resistant lead-free solder interconnect structures |
Charles L. Arvin, KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu +4 more |
2016-06-28 |
$2,208,000 |
| 9343420 |
Universal solder joints for 3D packaging |
Brian M. Erwin, Nicholas A. Polomoff, Jae-Woong Nah |
2016-05-17 |
$1,734,000 |
| 9324669 |
Use of electrolytic plating to control solder wetting |
Charles L. Arvin, Brian M. Erwin, Wolfgang Sauter |
2016-04-26 |
$2,956,000 |
| 9190376 |
Organic coating to inhibit solder wetting on pillar sidewalls |
Charles L. Arvin, Brian M. Erwin, Wolfgang Sauter, Thomas A. Wassick |
2015-11-17 |
$3,493,000 |
| 9177928 |
Contact and solder ball interconnect |
Charles L. Arvin, Wolfgang Sauter |
2015-11-03 |
$718,000 |
| 9142501 |
Under ball metallurgy (UBM) for improved electromigration |
Charles L. Arvin, Minhua Lu, David J. Russell, Wolfgang Sauter, Krystyna W. Semkow +1 more |
2015-09-22 |
$4,871,000 |
| 9084378 |
Under ball metallurgy (UBM) for improved electromigration |
Charles L. Arvin, Minhua Lu, Krystyna W. Semkow, Thomas A. Wassick |
2015-07-14 |
$7,900,000 |
| 8937009 |
Far back end of the line metallization method and structures |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Karen P. McLaughlin, Ekta Misra, Christopher D. Muzzy +1 more |
2015-01-20 |
$6,263,000 |
| 8910853 |
Additives for grain fragmentation in Pb-free Sn-based solder |
Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more |
2014-12-16 |
$3,695,000 |
| 8820612 |
Injection molded solder process for forming solder bumps on substrates |
Claudius Feger, Mark H. McLeod, Jae-Woong Nah |
2014-09-02 |
$3,373,000 |
| 8742578 |
Solder volume compensation with C4 process |
Charles L. Arvin, Wolfgang Sauter, Jennifer D. Schuler |
2014-06-03 |
$4,638,000 |
| 8518741 |
Wafer-to-wafer process for manufacturing a stacked structure |
Minhua Lu |
2013-08-27 |
$5,858,000 |
| 8496159 |
Injection molded solder process for forming solder bumps on substrates |
Claudius Feger, Mark H. McLeod, Jae-Woong Nah |
2013-07-30 |
$15,502,000 |
| 8493746 |
Additives for grain fragmentation in Pb-free Sn-based solder |
Charles L. Arvin, Alexandre Blander, Peter J. Brofman, Donald W. Henderson, Gareth G. Hougham +7 more |
2013-07-23 |
$2,085,000 |
