Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334461 | Bonding structure using two oxide layers with different stress levels, and related method | Sarah H. Knickerbocker, Lloyd Burrell, John J. Garant, Matthew C. Gorfien | 2025-06-17 |
| 11502106 | Multi-layered substrates of semiconductor devices | Benjamin V. Fasano, Koushik Ramachandran, Ian Melville, Sarah H. Knickerbocker | 2022-11-15 |
| 10520679 | Fiber alignment to photonics chip | Sarah H. Knickerbocker, Tracy A. Tong | 2019-12-31 |
| 9805977 | Integrated circuit structure having through-silicon via and method of forming same | Vijay Sukumaran, Thuy L. Tran-Quinn, John J. Garant | 2017-10-31 |
| 9728440 | Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer | Charles L. Arvin, Harry D. Cox, Brian M. Erwin, Eric D. Perfecto, Jennifer D. Schuler | 2017-08-08 |
| 9679796 | Anodized metal on carrier wafer | Charles L. Arvin, Harry D. Cox, Jennifer D. Schuler | 2017-06-13 |
| 8574675 | Method and composition for depositing ruthenium with assistive metal species | Thomas M. Cameron, Chongying Xu, Weimin Li | 2013-11-05 |
| 7358589 | Amorphous carbon metal-to-metal antifuse with adhesion promoting layers | Frank Hawley, A. Farid Issaq, John McCollum, Shubhra Gangopadhyay, Jin Miao Shen | 2008-04-15 |
| 6965156 | Amorphous carbon metal-to-metal antifuse with adhesion promoting layers | Frank Hawley, A. Farid Issaq, John McCollum, Shubhra Gangopadhyay, Jin Miao Shen | 2005-11-15 |