Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10041183 | Electrodeposition systems and methods that minimize anode and/or plating solution degradation | Charles L. Arvin, Eric D. Perfecto | 2018-08-07 |
| 10002835 | Structure for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Katsuyuki Sakuma, Eric D. Perfecto | 2018-06-19 |
| 9853006 | Semiconductor device contact structure having stacked nickel, copper, and tin layers | Charles L. Arvin, Eric D. Perfecto, Thomas A. Wassick | 2017-12-26 |
| 9804498 | Filtering lead from photoresist stripping solution | Charles L. Arvin, Arthur G. Merryman, Jennifer D. Schuler | 2017-10-31 |
| 9728440 | Non-transparent microelectronic grade glass as a substrate, temporary carrier or wafer | Charles L. Arvin, Brian M. Erwin, Jorge A. Lubguban, Eric D. Perfecto, Jennifer D. Schuler | 2017-08-08 |
| 9689084 | Electrodeposition systems and methods that minimize anode and/or plating solution degradation | Charles L. Arvin, Eric D. Perfecto | 2017-06-27 |
| 9679796 | Anodized metal on carrier wafer | Charles L. Arvin, Jorge A. Lubguban, Jennifer D. Schuler | 2017-06-13 |
| 9607973 | Method for establishing interconnects in packages using thin interposers | Benjamin V. Fasano, Michael S. Cranmer, Richard F. Indyk, Katsuyuki Sakuma, Eric D. Perfecto | 2017-03-28 |
| 9401336 | Dual layer stack for contact formation | Charles L. Arvin, Brian M. Erwin, Sarah H. Knickerbocker, Karen P. McLaughlin, David J. Russell | 2016-07-26 |
| 9396991 | Multilayered contact structure having nickel, copper, and nickel-iron layers | Charles L. Arvin, Eric D. Perfecto, Thomas A. Wassick | 2016-07-19 |
| 9347147 | Method and apparatus for controlling and monitoring the potential | Charles L. Arvin, Hariklia Deligianni, George J. Scott | 2016-05-24 |
| 9062388 | Method and apparatus for controlling and monitoring the potential | Charles L. Arvin, Hariklia Deligianni, George J. Scott | 2015-06-23 |
| 9035459 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Krystyna W. Semkow, Timothy D. Sullivan | 2015-05-19 |
| 8803317 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Krystyna W. Semkow, Timothy D. Sullivan | 2014-08-12 |
| 8623194 | Multi-anode system for uniform plating of alloys | Charles L. Arvin, Raschid J. Bezama, Krystyna W. Semkow | 2014-01-07 |
| 8551303 | Multi-anode system for uniform plating of alloys | Charles L. Arvin, Raschid J. Bezama, Krystyna W. Semkow | 2013-10-08 |
| 8338286 | Dimensionally decoupled ball limiting metalurgy | Eric David Perfecto, Timothy H. Daubenspeck, David L. Questad, Brian R. Sundlof | 2012-12-25 |
| 8177945 | Multi-anode system for uniform plating of alloys | Charles L. Arvin, Raschid J. Bezama, Krystyna W. Semkow | 2012-05-15 |
| 8020599 | Common carrier | Robert L. Baan, John P. Gauci, John R. Lankard, Jr., David C. Long, Thong N. Nguyen | 2011-09-20 |
| 7879171 | Common carrier | Robert L. Baan, John P. Gauci, John R. Lankard, Jr., David C. Long, Thong N. Nguyen | 2011-02-01 |
| 7683493 | Intermetallic diffusion block device and method of manufacture | Charles L. Arvin, Carla A. Bailey, Hua Gan, Hsichang Liu, Arthur G. Merryman +3 more | 2010-03-23 |
| 7472650 | Nickel alloy plated structure | Hsichang Liu, Nike Medahunsi, Krystyna W. Semkow | 2009-01-06 |
| 7287468 | Nickel alloy plated structure | Hsichang Liu, Nike Medahunsi, Krystyna W. Semkow | 2007-10-30 |
| 7278459 | Common carrier | Robert L. Baan, John P. Gauci, John R. Lankard, Jr., David C. Long, Thong N. Nguyen | 2007-10-09 |
| 7138326 | Wafer integrated rigid support ring | David Daniel, Leonard Gardecki, Albert Gregoritsch, Ruth Machell Julianelle, Charles Keeler +5 more | 2006-11-21 |