Issued Patents All Time
Showing 1–25 of 74 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242931 | Liquid cooled compliant heat sink and related method | David C. Long, Govindarajan Natarajan, Thomas Weiss | 2019-03-26 |
| 10177075 | Liquid cooled compliant heat sink and related method | David C. Long, Govindarajan Natarajan, Thomas Weiss | 2019-01-08 |
| 9574283 | Rinsing and drying for electrochemical processing | Charles L. Arvin, Hariklia Deligianni | 2017-02-21 |
| 9222194 | Rinsing and drying for electrochemical processing | Charles L. Arvin, Hariklia Deligianni | 2015-12-29 |
| 9035459 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Harry D. Cox, Timothy H. Daubenspeck, Krystyna W. Semkow, Timothy D. Sullivan | 2015-05-19 |
| 9018760 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad +3 more | 2015-04-28 |
| 8926820 | Working electrode design for electrochemical processing of electronic components | Charles L. Arvin, Glen N. Biggs, Hariklia Deligianni, Tracy A. Tong | 2015-01-06 |
| 8803317 | Structures for improving current carrying capability of interconnects and methods of fabricating the same | Charles L. Arvin, Harry D. Cox, Timothy H. Daubenspeck, Krystyna W. Semkow, Timothy D. Sullivan | 2014-08-12 |
| 8784618 | Working electrode design for electrochemical processing of electronic components | Charles L. Arvin, Glen N. Biggs, Hariklia Deligianni, Tracy A. Tong | 2014-07-22 |
| 8772927 | Semiconductor package structures having liquid cooler integrated with first level chip package modules | Evan G. Colgan, Michael A. Gaynes, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei | 2014-07-08 |
| 8674506 | Structures and methods to reduce maximum current density in a solder ball | Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra, George J. Scott +6 more | 2014-03-18 |
| 8637392 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Timothy H. Daubenspeck, Jeffrey P. Gambino, Christopher D. Muzzy, David L. Questad +3 more | 2014-01-28 |
| 8623194 | Multi-anode system for uniform plating of alloys | Charles L. Arvin, Harry D. Cox, Krystyna W. Semkow | 2014-01-07 |
| 8551303 | Multi-anode system for uniform plating of alloys | Charles L. Arvin, Harry D. Cox, Krystyna W. Semkow | 2013-10-08 |
| 8505617 | Structure and apparatus for cooling integrated circuits using copper microchannels | Evan G. Colgan, Madhusudan K. Iyengar, John Harold Magerlein, Roger R. Schmidt | 2013-08-13 |
| 8450619 | Current spreading in organic substrates | Charles L. Arvin | 2013-05-28 |
| 8446006 | Structures and methods to reduce maximum current density in a solder ball | Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra, George J. Scott +6 more | 2013-05-21 |
| 8418751 | Stacked and redundant chip coolers | Evan G. Colgan, John Harold Magerlein | 2013-04-16 |
| 8210243 | Structure and apparatus for cooling integrated circuits using cooper microchannels | Evan G. Colgan, Madhusudan K. Iyengar, John Harold Magerlein, Roger R. Schmidt | 2012-07-03 |
| 8177945 | Multi-anode system for uniform plating of alloys | Charles L. Arvin, Harry D. Cox, Krystyna W. Semkow | 2012-05-15 |
| 8115303 | Semiconductor package structures having liquid coolers integrated with first level chip package modules | Evan G. Colgan, Michael A. Gaynes, John Harold Magerlein, Kenneth C. Marston, Xiaojin Wei | 2012-02-14 |
| 8107800 | Method and structure to control thermal gradients in semiconductor wafers during rapid thermal processing | Lewis S. Goldmann, Donald R. Wall | 2012-01-31 |
| 7992627 | Microjet module assembly | Govindarajan Natarajan, Kamal K. Sikka, Hilton T. Toy | 2011-08-09 |
| 7869002 | Reducing contamination in immersion lithography | Dmitriy Shneyder, Dario L. Goldfarb, Kafal Lai | 2011-01-11 |
| 7802442 | High power microjet cooler | Govindarajan Natarajan | 2010-09-28 |