| 9040418 |
Enhanced capture pads for through semiconductor vias |
Mukta G. Farooq, John A. Griesemer, Kevin S. Petrarca, Richard P. Volant |
2015-05-26 |
| 8772949 |
Enhanced capture pads for through semiconductor vias |
Mukta G. Farooq, John A. Griesemer, Kevin S. Petrarca, Richard P. Volant |
2014-07-08 |
| 8674506 |
Structures and methods to reduce maximum current density in a solder ball |
Raschid J. Bezama, Timothy H. Daubenspeck, Ian D. Melville, Ekta Misra, George J. Scott +6 more |
2014-03-18 |
| 8487447 |
Semiconductor structure having offset passivation to reduce electromigration |
Mario J. Interrante, Michael J. Shapiro, Thomas A. Wassick, Bucknell C. Webb |
2013-07-16 |
| 8446006 |
Structures and methods to reduce maximum current density in a solder ball |
Raschid J. Bezama, Timothy H. Daubenspeck, Ian D. Melville, Ekta Misra, George J. Scott +6 more |
2013-05-21 |
| 8298929 |
Offset solder vias, methods of manufacturing and design structures |
Timothy H. Daubenspeck, Ekta Misra, David L. Questad, George J. Scott, Krystyna W. Semkow +3 more |
2012-10-30 |
| 8288270 |
Enhanced electromigration resistance in TSV structure and design |
Mukta G. Farooq, John A. Griesemer, William Francis Landers, Timothy D. Sullivan |
2012-10-16 |
| 8237288 |
Enhanced electromigration resistance in TSV structure and design |
Mukta G. Farooq, John A. Griesemer, William Francis Landers, Timothy D. Sullivan |
2012-08-07 |
| 7271681 |
Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boards |
Warren D. Dyckman, Edward R. Pillai |
2007-09-18 |
