WD

Warren D. Dyckman

IBM: 9 patents #11,918 of 70,183Top 20%
Overall (All Time): #579,874 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8214660 Structure for an apparatus for monitoring and controlling heat generation in a multi-core processor Louis Bennie Capps, Jr., Michael J. Shapiro 2012-07-03
7721119 System and method to optimize multi-core microprocessor performance using voltage offsets Louis Bennie Capps, Jr., Joanne Ferris, Anand Haridass, James D. Jordan, Ronald E. Newhart +2 more 2010-05-18
7617403 Method and apparatus for controlling heat generation in a multi-core processor Louis Bennie Capps, Jr., Michael J. Shapiro 2009-11-10
7584369 Method and apparatus for monitoring and controlling heat generation in a multi-core processor Louis Bennie Capps, Jr., Michael J. Shapiro 2009-09-01
7271681 Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boards Gary LaFontant, Edward R. Pillai 2007-09-18
7085143 In-module current source Edward R. Pillai, Daniel O'Connor 2006-08-01
6680530 Multi-step transmission line for multilayer packaging Edward R. Pillai 2004-01-20
6657864 High density thermal solution for direct attach modules Edward R. Pillai, Jeffrey A. Zitz 2003-12-02
6583498 Integrated circuit packaging with tapered striplines of constant impedance Edward R. Pillai, Deana Cosmadelis 2003-06-24