Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011886 | Packaging of a directly modulated laser chip in photonics module | Frank Gelhausen, Ahmed Sanaa Ahmed Awny, Ulrich Schacht, Oliver Piepenstock | 2021-05-18 |
| 10615567 | Packaging of a directly modulated laser chip in photonics module | Frank Gelhausen, Ahmed Sanaa Ahmed Awny, Ulrich Schacht, Oliver Piepenstock | 2020-04-07 |
| 7956628 | Chip-based prober for high frequency measurements and methods of measuring | Erik Breiland, Ullrich R. Pfeiffer | 2011-06-07 |
| 7397261 | Monitoring system for detecting and characterizing classes of leakage in CMOS devices | Louis L. Hsu, Joseph Natonio, James D. Rockrohr, David R. Hanson | 2008-07-08 |
| 7271681 | Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boards | Warren D. Dyckman, Gary LaFontant | 2007-09-18 |
| 7265433 | On-pad broadband matching network | Louis L. Hsu, Wolfgang Sauter, Daniel W. Storaska | 2007-09-04 |
| 7085143 | In-module current source | Warren D. Dyckman, Daniel O'Connor | 2006-08-01 |
| 6975199 | Embedded inductor and method of making | David C. Long, Harsaran S. Bhatia, Harvey C. Hamel, Christopher D. Setzer, Benjamin Tongue | 2005-12-13 |
| 6931712 | Method of forming a dielectric substrate having a multiturn inductor | David C. Long, Harsaran S. Bhatia, Harvey C. Hamel, Christopher D. Setzer, Benjamin Tongue | 2005-08-23 |
| 6806793 | MLC frequency selective circuit structures | Harsaran S. Bhatia, Harvey C. Hamel, David C. Long, Christopher D. Setzer, Benjamin Tongue | 2004-10-19 |
| 6680530 | Multi-step transmission line for multilayer packaging | Warren D. Dyckman | 2004-01-20 |
| 6657864 | High density thermal solution for direct attach modules | Warren D. Dyckman, Jeffrey A. Zitz | 2003-12-02 |
| 6583498 | Integrated circuit packaging with tapered striplines of constant impedance | Warren D. Dyckman, Deana Cosmadelis | 2003-06-24 |
| 6501174 | Interconnect structure for surface mounted devices | Krystyna W. Semkow, Linda L. Rapp | 2002-12-31 |