Issued Patents All Time
Showing 25 most recent of 63 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431404 | Fatigue failure resistant electronic package | Kamal K. Sikka, Shidong Li, Tuhin Sinha | 2025-09-30 |
| 12028997 | Rotating lid for module cooler | Noah Singer, Mark D. Schultz, John G. Torok, William L. Brodsky, Yuet-Ying Yu +1 more | 2024-07-02 |
| 11800666 | Temporary removable module lid | Noah Singer, Mark D. Schultz, John G. Torok, Yuet-Ying Yu, William L. Brodsky +1 more | 2023-10-24 |
| 11264306 | Hybrid TIMs for electronic package cooling | Kamal K. Sikka, Piyas Bal Chowdhury, James J. Kelly, Sushumna Iruvanti, Shidong Li | 2022-03-01 |
| 11156409 | Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover | Hongqing Zhang, Jay A. Bunt, David J. Lewison, Joyce E. Molinelli Acocella, Frank L. Pompeo | 2021-10-26 |
| 11158562 | Conformal integrated circuit (IC) device package lid | David J. Lewison, Hongqing Zhang, Jay A. Bunt, Sushumna Iruvanti | 2021-10-26 |
| 10978314 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy | 2021-04-13 |
| 10905029 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner | 2021-01-26 |
| 10892170 | Fabricating an integrated circuit chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Hilton T. Toy | 2021-01-12 |
| 10842043 | Fabricating coolant-cooled heat sinks with internal thermally-conductive fins | Hongqing Zhang, David J. Lewison, Jay A. Bunt, Joyce E. Molinelli Acocella, Frank L. Pompeo | 2020-11-17 |
| 10757833 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner | 2020-08-25 |
| 10593564 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy | 2020-03-17 |
| 10566215 | Method of fabricating a chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Hilton T. Toy | 2020-02-18 |
| 10541156 | Multi integrated circuit chip carrier package | Marcus E. Interrante, Kathryn R. Lange, Kamal K. Sikka, Tuhin Sinha, Hilton T. Toy | 2020-01-21 |
| 10542636 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner | 2020-01-21 |
| 10424494 | Chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Hilton T. Toy | 2019-09-24 |
| 10381276 | Test cell for laminate and method | Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more | 2019-08-13 |
| 10332813 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy | 2019-06-25 |
| 10249548 | Test cell for laminate and method | Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more | 2019-04-02 |
| 10172258 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner | 2019-01-01 |
| 10090173 | Method of fabricating a chip module with stiffening frame and directional heat spreader | Evan G. Colgan, Yi Pan, Hilton T. Toy | 2018-10-02 |
| 10083886 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy | 2018-09-25 |
| 10049896 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy | 2018-08-14 |
| 9947603 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy | 2018-04-17 |
| 9721870 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner | 2017-08-01 |