Jay A. Bunt — 13 Patents at IBM

Jay A. Bunt has been granted 13 US patents while listed as an inventor at IBM. The first was granted in 2010 and the most recent in April 2025. Jay A. Bunt ranks #362,438 of 4,157,543 US inventors in our database (top 8.7%). Patent records list Jay A. Bunt in Esopus, NY, US.

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12274966	Filter device having multiple changeable filter surfaces	Madhana Sunder, Allan C. VanDeventer, Joyce E. Molinelli Acocella, Heather Nicole Polgrean, Hongqing Zhang +1 more	2025-04-15
12005148	Coolant-cooled heat sink(s) with associated ultra-violet light assembly	Hongqing Zhang, David J. Lewison, Frank L. Pompeo, James A. Busby, Joyce E. Molinelli Acocella +2 more	2024-06-11	$12,881,000
11940271	High power device fault localization via die surface contouring	David J. Lewison, Frank L. Pompeo, Richard W. Oldrey, John D. Sylvestri, Phong T. Tran	2024-03-26	$9,065,000
11716808	Tamper-respondent assemblies with porous heat transfer element(s)	Hongqing Zhang, Arthur J. Higby, David J. Lewison, Philipp K Buchling Rego, James A. Busby +1 more	2023-08-01	$14,809,000
11614324	Non-destructive bond line thickness measurement of thermal interface material on silicon packages	Hongqing Zhang, David J. Lewison, Joyce E. Molinelli Acocella, Yu Luo	2023-03-28	$13,323,000
11430710	Lid/heat spreader having targeted flexibility	Shidong Li, Kenneth C. Marston, Hilton T. Toy, Hongqing Zhang, David J. Lewison	2022-08-30	$8,668,000
11191155	Tamper-respondent assembly with structural material within sealed inner compartment	Hongqing Zhang, Shidong Li, Zhigang Song, Junjun Li, Guoda Lian	2021-11-30	$2,996,000
11156409	Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover	Hongqing Zhang, David J. Lewison, Joyce E. Molinelli Acocella, Frank L. Pompeo, Jeffrey A. Zitz	2021-10-26	$2,874,000
11158562	Conformal integrated circuit (IC) device package lid	David J. Lewison, Hongqing Zhang, Jeffrey A. Zitz, Sushumna Iruvanti	2021-10-26	$2,874,000
10842043	Fabricating coolant-cooled heat sinks with internal thermally-conductive fins	Hongqing Zhang, David J. Lewison, Joyce E. Molinelli Acocella, Jeffrey A. Zitz, Frank L. Pompeo	2020-11-17	$2,639,000
8156990	Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers	Donald W. DiAngelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton +7 more	2012-04-17	$5,847,000
7947143	Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers	Donald W. DiAngelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton +7 more	2011-05-24	$5,693,000
7836935	Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers	Donald W. DiAngelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton +7 more	2010-11-23	$4,291,000

Jay A. Bunt — 13 Patents

Issued Patents All Time

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