| 12274966 |
Filter device having multiple changeable filter surfaces |
Madhana Sunder, Allan C. VanDeventer, Joyce E. Molinelli Acocella, Heather Nicole Polgrean, Hongqing Zhang +1 more |
2025-04-15 |
| 12005148 |
Coolant-cooled heat sink(s) with associated ultra-violet light assembly |
Hongqing Zhang, David J. Lewison, Frank L. Pompeo, James A. Busby, Joyce E. Molinelli Acocella +2 more |
2024-06-11 |
| 11940271 |
High power device fault localization via die surface contouring |
David J. Lewison, Frank L. Pompeo, Richard W. Oldrey, John D. Sylvestri, Phong T. Tran |
2024-03-26 |
| 11716808 |
Tamper-respondent assemblies with porous heat transfer element(s) |
Hongqing Zhang, Arthur J. Higby, David J. Lewison, Philipp K Buchling Rego, James A. Busby +1 more |
2023-08-01 |
| 11614324 |
Non-destructive bond line thickness measurement of thermal interface material on silicon packages |
Hongqing Zhang, David J. Lewison, Joyce E. Molinelli Acocella, Yu Luo |
2023-03-28 |
| 11430710 |
Lid/heat spreader having targeted flexibility |
Shidong Li, Kenneth C. Marston, Hilton T. Toy, Hongqing Zhang, David J. Lewison |
2022-08-30 |
| 11191155 |
Tamper-respondent assembly with structural material within sealed inner compartment |
Hongqing Zhang, Shidong Li, Zhigang Song, Junjun Li, Guoda Lian |
2021-11-30 |
| 11156409 |
Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover |
Hongqing Zhang, David J. Lewison, Joyce E. Molinelli Acocella, Frank L. Pompeo, Jeffrey A. Zitz |
2021-10-26 |
| 11158562 |
Conformal integrated circuit (IC) device package lid |
David J. Lewison, Hongqing Zhang, Jeffrey A. Zitz, Sushumna Iruvanti |
2021-10-26 |
| 10842043 |
Fabricating coolant-cooled heat sinks with internal thermally-conductive fins |
Hongqing Zhang, David J. Lewison, Joyce E. Molinelli Acocella, Jeffrey A. Zitz, Frank L. Pompeo |
2020-11-17 |
| 8156990 |
Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers |
Donald W. DiAngelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton +7 more |
2012-04-17 |
| 7947143 |
Method for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers |
Donald W. DiAngelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton +7 more |
2011-05-24 |
| 7836935 |
Apparatus for providing uniaxial load distribution for laminate layers of multilayer ceramic chip carriers |
Donald W. DiAngelo, Cristian Docu, Thomas Foley, Melvin R. Gottschalk, Jr., Lisa A. Hamilton +7 more |
2010-11-23 |
