Issued Patents All Time
Showing 1–25 of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12005148 | Coolant-cooled heat sink(s) with associated ultra-violet light assembly | Hongqing Zhang, David J. Lewison, James A. Busby, Jay A. Bunt, Joyce E. Molinelli Acocella +2 more | 2024-06-11 |
| 11940271 | High power device fault localization via die surface contouring | David J. Lewison, Jay A. Bunt, Richard W. Oldrey, John D. Sylvestri, Phong T. Tran | 2024-03-26 |
| 11404287 | Fixture facilitating heat sink fabrication | Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Jason R. Eagle, Mark K. Hoffmeyer +3 more | 2022-08-02 |
| 11156409 | Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover | Hongqing Zhang, Jay A. Bunt, David J. Lewison, Joyce E. Molinelli Acocella, Jeffrey A. Zitz | 2021-10-26 |
| 10978313 | Fixture facilitating heat sink fabrication | Phillip Duane Isaacs, Christopher M. Marroquin, Daren Simmons, Jason R. Eagle, Mark K. Hoffmeyer +3 more | 2021-04-13 |
| 10842043 | Fabricating coolant-cooled heat sinks with internal thermally-conductive fins | Hongqing Zhang, David J. Lewison, Jay A. Bunt, Joyce E. Molinelli Acocella, Jeffrey A. Zitz | 2020-11-17 |
| 10750615 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2020-08-18 |
| 10368441 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2019-07-30 |
| 9974179 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2018-05-15 |
| 9627784 | Method and apparatus for strain relieving surface mount attached connectors | Michael A. Gaynes, Jeffrey D. Gelorme, Robert P. Kuder, II, Daniel J. Littrell, Thomas E. Lombardi +5 more | 2017-04-18 |
| 8492199 | Reworkable underfills for ceramic MCM C4 protection | Jeffrey T. Coffin, Steven P. Ostrander, Jiali Wu | 2013-07-23 |
| 7900809 | Solder interconnection array with optimal mechanical integrity | Glenn G. Daves, David L. Edwards, Mukta G. Farooq | 2011-03-08 |
| 7882623 | Apparatus for removing interconnects to separate two parts of a workpiece | Mukta G. Farooq, Ray Jackson, David C. Linnell | 2011-02-08 |
| 7806341 | Structure for implementing secure multichip modules for encryption applications | Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia +2 more | 2010-10-05 |
| 7544527 | Method and apparatus for providing optoelectronic communication with an electronic device | Alan F. Benner, How T. Lin, Subhash L. Shinde | 2009-06-09 |
| 7472836 | Method and structure for implementing secure multichip modules for encryption applications | Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia +2 more | 2009-01-06 |
| 7452215 | Ball grid array rework using a continuous belt furnace | Mukta G. Farooq, Ray Jackson, David C. Linnell | 2008-11-18 |
| 7445141 | Solder interconnection array with optimal mechanical integrity | Glenn G. Daves, David L. Edwards, Mukta G. Farooq | 2008-11-04 |
| 7299530 | Ball grid array rework using a continuous belt furnace | Mukta G. Farooq, Ray Jackson, David C. Linnell | 2007-11-27 |
| 7281667 | Method and structure for implementing secure multichip modules for encryption applications | Mukta G. Farooq, Benjamin V. Fasano, Jason L. Frankel, Harvey C. Hamel, Suresh D. Kadakia +2 more | 2007-10-16 |
| 7245022 | Semiconductor module with improved interposer structure and method for forming the same | Mukta G. Farooq, John U. Knickerbocker, Subhash L. Shinde | 2007-07-17 |
| 7128472 | Method and apparatus for providing optoelectronic communication with an electronic device | Alan F. Benner, Evan G. Colgan, How T. Lin, John Harold Magerlein, Subhash L. Shinde +1 more | 2006-10-31 |
| 7084496 | Method and apparatus for providing optoelectronic communication with an electronic device | Alan F. Benner, How T. Lin, Subhash L. Shinde | 2006-08-01 |
| 7079393 | Fluidic cooling systems and methods for electronic components | Evan G. Colgan, Glenn G. Daves, Hilton T. Toy, Bruce K. Furman, David L. Edwards +7 more | 2006-07-18 |
| 6964885 | Stress resistant land grid array (LGA) module and method of forming the same | Patrick A. Coico, James H. Covell, Benjamin V. Fasano, Lewis S. Goldman, Ronald L. Hering +4 more | 2005-11-15 |