Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12005148 | Coolant-cooled heat sink(s) with associated ultra-violet light assembly | Hongqing Zhang, Frank L. Pompeo, James A. Busby, Jay A. Bunt, Joyce E. Molinelli Acocella +2 more | 2024-06-11 |
| 11940271 | High power device fault localization via die surface contouring | Jay A. Bunt, Frank L. Pompeo, Richard W. Oldrey, John D. Sylvestri, Phong T. Tran | 2024-03-26 |
| 11716808 | Tamper-respondent assemblies with porous heat transfer element(s) | Hongqing Zhang, Arthur J. Higby, Philipp K Buchling Rego, Jay A. Bunt, James A. Busby +1 more | 2023-08-01 |
| 11614324 | Non-destructive bond line thickness measurement of thermal interface material on silicon packages | Hongqing Zhang, Jay A. Bunt, Joyce E. Molinelli Acocella, Yu Luo | 2023-03-28 |
| 11430710 | Lid/heat spreader having targeted flexibility | Shidong Li, Jay A. Bunt, Kenneth C. Marston, Hilton T. Toy, Hongqing Zhang | 2022-08-30 |
| 11156409 | Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover | Hongqing Zhang, Jay A. Bunt, Joyce E. Molinelli Acocella, Frank L. Pompeo, Jeffrey A. Zitz | 2021-10-26 |
| 11158562 | Conformal integrated circuit (IC) device package lid | Hongqing Zhang, Jay A. Bunt, Jeffrey A. Zitz, Sushumna Iruvanti | 2021-10-26 |
| 10842043 | Fabricating coolant-cooled heat sinks with internal thermally-conductive fins | Hongqing Zhang, Jay A. Bunt, Joyce E. Molinelli Acocella, Jeffrey A. Zitz, Frank L. Pompeo | 2020-11-17 |
| 9673177 | Selectively soluble standoffs for chip joining | Benjamin V. Fasano, Mark W. Kapfhammer, Thomas E. Lombardi, Thomas Weiss | 2017-06-06 |