Issued Patents All Time
Showing 25 most recent of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12414229 | Tearing security feature of printed circuit substrates | Arthur J. Higby, David C. Long, William Santiago-Fernandez, John R. Dangler, Russell A. Budd +3 more | 2025-09-09 |
| 12207392 | Electronic component comprising first and second conductive traces and a void formed in an insulative layer between the first and second traces providing crosstalk reduction | Matthew S. Doyle, David C. Long, Matteo Cocchini, Russell A. Budd, Roger S. Krabbenhoft +1 more | 2025-01-21 |
| 12005148 | Coolant-cooled heat sink(s) with associated ultra-violet light assembly | Hongqing Zhang, David J. Lewison, Frank L. Pompeo, Jay A. Bunt, Joyce E. Molinelli Acocella +2 more | 2024-06-11 |
| 11991277 | Cryptographic hardware security module with secure embedded heat pipe | Arthur J. Higby, David C. Long, Edward N. Cohen, John R. Dangler, Matthew S. Doyle +3 more | 2024-05-21 |
| 11882645 | Multi chip hardware security module | Sushumna Iruvanti, Philipp K Buchling Rego, Steven P. Ostrander, Thomas A. Wassick, William Santiago-Fernandez +1 more | 2024-01-23 |
| 11822707 | Secure ventilation through protective flexible sensors | William Santiago-Fernandez, Russell A. Budd, Arthur J. Higby, Michael J. Fisher, Silvio Dragone +2 more | 2023-11-21 |
| 11765816 | Tamper-respondent assemblies with pressure connector assemblies | Arthur J. Higby, William L. Brodsky, Levi A. Campbell, David C. Long, Philipp K Buchling Rego | 2023-09-19 |
| 11716808 | Tamper-respondent assemblies with porous heat transfer element(s) | Hongqing Zhang, Arthur J. Higby, David J. Lewison, Philipp K Buchling Rego, Jay A. Bunt +1 more | 2023-08-01 |
| 11614497 | Leakage characterization for electronic circuit temperature monitoring | Matthew S. Doyle, Edward N. Cohen, John R. Dangler, Gerald K. Bartley, Michael J. Fisher +4 more | 2023-03-28 |
| 11493565 | Leakage characterization and management for electronic circuit enhancement | Matthew S. Doyle, Edward N. Cohen, John R. Dangler, Michael J. Fisher, Arthur J. Higby +1 more | 2022-11-08 |
| 11382210 | Dielectric material change to optimize electrical and mechanical properties of flex circuit | John R. Dangler, Arthur J. Higby, Philipp K Buchling Rego, David C. Long, Matthew S. Doyle +3 more | 2022-07-05 |
| 11244079 | Data detection mitigation in printed circuit boards | Matteo Cocchini, Silvio Dragone, Stefano S. Oggioni, William Santiago-Fernandez | 2022-02-08 |
| 11147158 | Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout | John R. Dangler, Michael J. Fisher, David C. Long | 2021-10-12 |
| 11122682 | Tamper-respondent sensors with liquid crystal polymer layers | John R. Dangler, Mark K. Hoffmeyer, William L. Brodsky, William Santiago-Fernandez, David C. Long +3 more | 2021-09-14 |
| 11083082 | Enclosure-to-board interface with tamper-detect circuit(s) | Kathleen Ann Fadden, David C. Long, John R. Dangler, Alexandra Echegaray, Michael J. Fisher +1 more | 2021-08-03 |
| 11026324 | Creating a secure volume | Arthur J. Higby, David C. Long, Michael J. Fisher, John R. Dangler, Robert Weiss +2 more | 2021-06-01 |
| 10956623 | Enclosure with tamper respondent sensor | Silvio Dragone, Michael J. Fisher, William Santiago Fernandez, Ryan Elsasser, John R. Dangler +3 more | 2021-03-23 |
| 10932374 | 3-D flex circuit forming | Arthur J. Higby, David C. Long, Robert Weiss, Michael J. Fisher, Tristen Gaudette | 2021-02-23 |
| 10798816 | Tamper detection at enclosure-to-board interface | Arthur J. Higby, David C. Long, Michael J. Fisher, Russell A. Budd, Michel Turgeon +1 more | 2020-10-06 |
| 10624202 | Tamper-respondent assemblies with bond protection | William L. Brodsky, Zachary Thomas Dreiss, Michael J. Fisher, David C. Long, William Santiago-Fernandez +1 more | 2020-04-14 |
| 10595419 | 3-D flex circuit forming | Arthur J. Higby, David C. Long, Robert Weiss, Michael J. Fisher, Tristen Gaudette | 2020-03-17 |
| 10595401 | Tamper detection at enclosure-to-board interface | Arthur J. Higby, David C. Long, Michael J. Fisher, Russell A. Budd, Michel Turgeon +1 more | 2020-03-17 |
| 10575398 | Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout | John R. Dangler, Michael J. Fisher, David C. Long | 2020-02-25 |
| 10568202 | Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout | John R. Dangler, Michael J. Fisher, David C. Long | 2020-02-18 |
| 10535619 | Tamper-proof electronic packages with stressed glass component substrate(s) | Silvio Dragone, Michael A. Gaynes, Kenneth P. Rodbell, William Santiago-Fernandez | 2020-01-14 |