| 12207392 |
Electronic component comprising first and second conductive traces and a void formed in an insulative layer between the first and second traces providing crosstalk reduction |
Matthew S. Doyle, David C. Long, Matteo Cocchini, Russell A. Budd, James A. Busby +1 more |
2025-01-21 |
| 11968780 |
Method to manufacture conductive anodic filament-resistant microvias |
Kyle Indukummar Giesen, Sarah K. Czaplewski-Campbell |
2024-04-23 |
| 10595416 |
Insertion loss reduction and increased bonding in a circuit apparatus |
Brian L. Carlson, John R. Dangler, Kevin A. Splittstoesser |
2020-03-17 |
| 10390439 |
Insertion loss reduction and increased bonding in a circuit apparatus |
Brian L. Carlson, John R. Dangler, Kevin A. Splittstoesser |
2019-08-20 |
| 10378924 |
Circuit boards and electronic packages with embedded tamper-respondent sensor |
William L. Brodsky, Silvio Dragone, David C. Long, Stefano S. Oggioni, Michael T. Peets +1 more |
2019-08-13 |
| 10378925 |
Circuit boards and electronic packages with embedded tamper-respondent sensor |
William L. Brodsky, Silvio Dragone, David C. Long, Stefano S. Oggioni, Michael T. Peets +1 more |
2019-08-13 |
| 10175064 |
Circuit boards and electronic packages with embedded tamper-respondent sensor |
William L. Brodsky, Silvio Dragone, David C. Long, Stefano S. Oggioni, Michael T. Peets +1 more |
2019-01-08 |
| 10168185 |
Circuit boards and electronic packages with embedded tamper-respondent sensor |
William L. Brodsky, Silvio Dragone, David C. Long, Stefano S. Oggioni, Michael T. Peets +1 more |
2019-01-01 |
| 9949357 |
Embedding an integrated venting system into a printed circuit board |
Michael J. Fisher |
2018-04-17 |
| 9942990 |
Insertion loss reduction and increased bonding in a circuit apparatus |
Brian L. Carlson, John R. Dangler, Kevin A. Splittstoesser |
2018-04-10 |
| 9930768 |
Embedded venting system |
Michael J. Fisher |
2018-03-27 |
| 9873132 |
Digital processing equipment |
John R. Dangler, Brian L. Carlson, Kevin A. Splittstoesser, Jeffrey A. Taylor |
2018-01-23 |
| 9648723 |
Process of fabricating printed circuit board |
Brian L. Carlson, John R. Dangler, Kevin A. Splittstoesser |
2017-05-09 |
| 9578735 |
Embedded venting system |
Michael J. Fisher |
2017-02-21 |
| 8819931 |
Enhanced-reliability printed circuit board for tight-pitch components |
Bruce J. Chamberlin, Mitchell G. Ferrill |
2014-09-02 |
| 8747122 |
Implementing connection of two large electronic boards utilizing LGA interconnect |
Terry Fredrick Banitt, John L. Colbert, Jason R. Eagle |
2014-06-10 |
| 8035409 |
System and method implementing short-pulse propagation technique on production-level boards with incremental accuracy and productivity levels |
Alina Deutsch, George A. Katopis, Gerard V. Kopcsay, Christopher Surovic |
2011-10-11 |
| 7615705 |
Enhanced-reliability printed circuit board for tight-pitch components |
Bruce J. Chamberlin, Mitchell G. Ferrill |
2009-11-10 |
| 7180752 |
Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications |
Bruce J. Chamberlin, Erica Elizabeth Jasper Gant |
2007-02-20 |
| 6822468 |
Method and apparatus for implementing printed circuit board high potential testing to identify latent defects |
David J. Braun, Erica Elizabeth Jasper |
2004-11-23 |
| 5910644 |
Universal surface finish for DCA, SMT and pad on pad interconnections |
Dale E. Goodman, Mark K. Hoffmeyer |
1999-06-08 |
