Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9563739 | Technology for temperature sensitive components in thermal processing | Curtis T. Grosskopf, Matthew S. Kelly, Thomas H. Lewis, Wen Wei Low | 2017-02-07 |
| 9317643 | Technology for temperature sensitive components in thermal processing | Curtis T. Grosskopf, Matthew S. Kelly, Thomas H. Lewis, Wen Wei Low | 2016-04-19 |
| 8819931 | Enhanced-reliability printed circuit board for tight-pitch components | Bruce J. Chamberlin, Roger S. Krabbenhoft | 2014-09-02 |
| 7795724 | Sandwiched organic LGA structure | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, David L. Questad, Robin A. Susko | 2010-09-14 |
| 7615705 | Enhanced-reliability printed circuit board for tight-pitch components | Bruce J. Chamberlin, Roger S. Krabbenhoft | 2009-11-10 |
| 7255571 | Temperature dependent semiconductor module connectors | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Robin A. Susko, James R. Wilcox | 2007-08-14 |
| 7137826 | Temperature dependent semiconductor module connectors | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Robin A. Susko, James R. Wilcox | 2006-11-21 |
| 7128579 | Hook interconnect | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Robin A. Susko, James R. Wilcox | 2006-10-31 |
| 6235994 | Thermal/electrical break for printed circuit boards | Bruce J. Chamberlin, Randall J. Stutzman, George H. Thiel | 2001-05-22 |