| 9563739 |
Technology for temperature sensitive components in thermal processing |
Curtis T. Grosskopf, Matthew S. Kelly, Thomas H. Lewis, Wen Wei Low |
2017-02-07 |
| 9317643 |
Technology for temperature sensitive components in thermal processing |
Curtis T. Grosskopf, Matthew S. Kelly, Thomas H. Lewis, Wen Wei Low |
2016-04-19 |
| 8819931 |
Enhanced-reliability printed circuit board for tight-pitch components |
Bruce J. Chamberlin, Roger S. Krabbenhoft |
2014-09-02 |
| 7795724 |
Sandwiched organic LGA structure |
William L. Brodsky, James A. Busby, Bruce J. Chamberlin, David L. Questad, Robin A. Susko |
2010-09-14 |
| 7615705 |
Enhanced-reliability printed circuit board for tight-pitch components |
Bruce J. Chamberlin, Roger S. Krabbenhoft |
2009-11-10 |
| 7255571 |
Temperature dependent semiconductor module connectors |
William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Robin A. Susko, James R. Wilcox |
2007-08-14 |
| 7137826 |
Temperature dependent semiconductor module connectors |
William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Robin A. Susko, James R. Wilcox |
2006-11-21 |
| 7128579 |
Hook interconnect |
William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Robin A. Susko, James R. Wilcox |
2006-10-31 |
| 6235994 |
Thermal/electrical break for printed circuit boards |
Bruce J. Chamberlin, Randall J. Stutzman, George H. Thiel |
2001-05-22 |
