Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7703199 | Method to accommodate increase in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman | 2010-04-27 |
| 7086147 | Method of accommodating in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman | 2006-08-08 |
| 7045562 | Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls | — | 2006-05-16 |
| 7037753 | Non-planar surface for semiconductor chips | William L. Brodsky, Sanjeev Sathe | 2006-05-02 |
| 6967389 | Wafer with semiconductor chips mounted thereon | William Infantolino, Voya R. Markovich, Sanjeev Sathe | 2005-11-22 |
| 6759270 | Semiconductor chip module and method of manufacture of same | William Infantolino, Voya R. Markovich, Sanjeev Sathe | 2004-07-06 |
| 6756662 | Semiconductor chip module and method of manufacture of same | William Infantolino, Voya R. Markovich, Sanjeev Sathe | 2004-06-29 |
| 6731012 | Non-planar surface for semiconductor chips | William L. Brodsky, Sanjeev Sathe | 2004-05-04 |
| 6686664 | Structure to accommodate increase in volume expansion during solder reflow | David V. Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman | 2004-02-03 |
| 6655020 | Method of packaging a high performance chip | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, Randall J. Stutzman | 2003-12-02 |
| 6649833 | Negative volume expansion lead-free electrical connection | David V. Caletka, Krishna Darbha, Donald W. Henderson, Lawrence P. Lehman | 2003-11-18 |
| 6552266 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, Randall J. Stutzman | 2003-04-22 |
| 6552264 | High performance chip packaging and method | Timothy F. Carden, Glenn O. Dearing, Kishor Desai, Stephen R. Engle, Randall J. Stutzman | 2003-04-22 |
| 6235994 | Thermal/electrical break for printed circuit boards | Bruce J. Chamberlin, Mitchell G. Ferrill, Randall J. Stutzman | 2001-05-22 |
| 6226187 | Integrated circuit package | David L. Questad, Anne Marie Quinn, Donna Jean Trevitt, Tien Y. Wu, Patrick Robert Zippetelli | 2001-05-01 |
| 6084299 | Integrated circuit package including a heat sink and an adhesive | David L. Questad, Anne Marie Quinn, Donna Jean Trevitt, Tien Y. Wu, Patrick Robert Zippetelli | 2000-07-04 |