| 9661770 |
Graphic formation via material ablation |
Mark Thomas McCormack, Raj N. Master, Michael J. Lane, Ralf Groene, James Alec Ishihara +1 more |
2017-05-23 |
| 8253688 |
Multi-mode optical navigation |
David D. Bohn, Jim Marshall, Brian L. Hastings |
2012-08-28 |
| 8132976 |
Reduced impact keyboard with cushioned keys |
Dan Odell, Richard E. Compton, Glen C. Larsen, Kurt Allen Jenkins |
2012-03-13 |
| 7796883 |
Flexible circuit connection |
Paul Hornikx, Juscelino Okura, Jagtar Saroya |
2010-09-14 |
| 7777722 |
Multi-mode optical navigation |
David D. Bohn, Jim Marshall, Brian L. Hastings |
2010-08-17 |
| 7703199 |
Method to accommodate increase in volume expansion during solder reflow |
David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel |
2010-04-27 |
| 7454977 |
Force measuring systems for digital pens and other products |
Glen C. Larsen, Michael Baseflug |
2008-11-25 |
| 7233025 |
Electronic packaging for optical emitters and sensors |
Pavan Davuluri, Mario R. Cristancho |
2007-06-19 |
| 7086147 |
Method of accommodating in volume expansion during solder reflow |
David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel |
2006-08-08 |
| 6989607 |
Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers |
Miguel A. Jimarez, Matthew Reiss, Sanjeev Sathe, Charles G. Woychik |
2006-01-24 |
| 6905961 |
Land grid array stiffener for use with flexible chip carriers |
David V. Caletka, William Infantolino, Eric A. Johnson |
2005-06-14 |
| 6686664 |
Structure to accommodate increase in volume expansion during solder reflow |
David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel |
2004-02-03 |
| 6649833 |
Negative volume expansion lead-free electrical connection |
David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel |
2003-11-18 |
| 6639302 |
Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries |
Miguel A. Jimarez, Matthew Reiss, Sanjeev Sathe, Charles G. Woychik |
2003-10-28 |
| 6631078 |
Electronic package with thermally conductive standoff |
David J. Alcoe, Varaprasad V. Calmidi, Sanjeev Sathe |
2003-10-07 |
| 6622786 |
Heat sink structure with pyramidic and base-plate cut-outs |
Varaprasad V. Calmidi, Sanjeev Sathe, Jamil A. Wakil |
2003-09-23 |
| 6528892 |
Land grid array stiffener use with flexible chip carriers |
David V. Caletka, William Infantolino, Eric A. Johnson |
2003-03-04 |
