Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9661770 | Graphic formation via material ablation | Mark Thomas McCormack, Raj N. Master, Michael J. Lane, Ralf Groene, James Alec Ishihara +1 more | 2017-05-23 |
| 8253688 | Multi-mode optical navigation | David D. Bohn, Jim Marshall, Brian L. Hastings | 2012-08-28 |
| 8132976 | Reduced impact keyboard with cushioned keys | Dan Odell, Richard E. Compton, Glen C. Larsen, Kurt Allen Jenkins | 2012-03-13 |
| 7796883 | Flexible circuit connection | Paul Hornikx, Juscelino Okura, Jagtar Saroya | 2010-09-14 |
| 7777722 | Multi-mode optical navigation | David D. Bohn, Jim Marshall, Brian L. Hastings | 2010-08-17 |
| 7703199 | Method to accommodate increase in volume expansion during solder reflow | David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel | 2010-04-27 |
| 7454977 | Force measuring systems for digital pens and other products | Glen C. Larsen, Michael Baseflug | 2008-11-25 |
| 7233025 | Electronic packaging for optical emitters and sensors | Pavan Davuluri, Mario R. Cristancho | 2007-06-19 |
| 7086147 | Method of accommodating in volume expansion during solder reflow | David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel | 2006-08-08 |
| 6989607 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers | Miguel A. Jimarez, Matthew Reiss, Sanjeev Sathe, Charles G. Woychik | 2006-01-24 |
| 6905961 | Land grid array stiffener for use with flexible chip carriers | David V. Caletka, William Infantolino, Eric A. Johnson | 2005-06-14 |
| 6686664 | Structure to accommodate increase in volume expansion during solder reflow | David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel | 2004-02-03 |
| 6649833 | Negative volume expansion lead-free electrical connection | David V. Caletka, Donald W. Henderson, Lawrence P. Lehman, George H. Thiel | 2003-11-18 |
| 6639302 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries | Miguel A. Jimarez, Matthew Reiss, Sanjeev Sathe, Charles G. Woychik | 2003-10-28 |
| 6631078 | Electronic package with thermally conductive standoff | David J. Alcoe, Varaprasad V. Calmidi, Sanjeev Sathe | 2003-10-07 |
| 6622786 | Heat sink structure with pyramidic and base-plate cut-outs | Varaprasad V. Calmidi, Sanjeev Sathe, Jamil A. Wakil | 2003-09-23 |
| 6528892 | Land grid array stiffener use with flexible chip carriers | David V. Caletka, William Infantolino, Eric A. Johnson | 2003-03-04 |