Issued Patents All Time
Showing 25 most recent of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8912051 | Method for controlling molding compound geometry around a semiconductor die | Ahmer Syed, Jeff Watson | 2014-12-16 |
| 8847372 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2014-09-30 |
| 8541260 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2013-09-24 |
| 8476748 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2013-07-02 |
| 8368194 | Exposed die overmolded flip chip package | Robert Francis Darveaux, Michael Barrow, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2013-02-05 |
| 8207022 | Exposed die overmolded flip chip package method | Robert Francis Darveaux, Michael Barrow, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2012-06-26 |
| 7898093 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Michael Barrow, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2011-03-01 |
| 7353590 | Method of forming printed circuit card | Kenneth Michael Fallon, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more | 2008-04-08 |
| 7328506 | Method for forming a plated microvia interconnect | Ross W. Keesler, Voya R. Markovich, Rajinder S. Rai, Cheryl L. Tytran-Palomaki | 2008-02-12 |
| 7278207 | Method of making an electronic package | Lisa J. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Charles H. Perry, Brenda Peterson | 2007-10-09 |
| 7270478 | X-ray alignment system for fabricating electronic chips | — | 2007-09-18 |
| 6989607 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers | Krishna Darbha, Matthew Reiss, Sanjeev Sathe, Charles G. Woychik | 2006-01-24 |
| 6986198 | Method of forming printed circuit card | Kenneth Michael Fallon, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more | 2006-01-17 |
| 6961995 | Method of making an electronic package | Lisa J. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Charles H. Perry, Brenda Peterson | 2005-11-08 |
| 6955982 | Flip chip C4 extension structure and process | Cynthia S. Milkovich, Mark V. Pierson | 2005-10-18 |
| 6818972 | Reduction of chip carrier flexing during thermal cycling | Lisa J. Jimarez | 2004-11-16 |
| 6757967 | Method of forming a chip assembly | Lisa J. Jimarez | 2004-07-06 |
| 6756680 | Flip chip C4 extension structure and process | Cynthia S. Milkovich, Mark V. Pierson | 2004-06-29 |
| 6750405 | Two signal one power plane circuit board | Kenneth Michael Fallon, Ross W. Keesler, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich +5 more | 2004-06-15 |
| 6664637 | Flip chip C4 extension structure and process | Cynthia S. Milkovich, Mark V. Pierson | 2003-12-16 |
| 6639302 | Stress reduction in flip-chip PBGA packaging by utilizing segmented chip carries | Krishna Darbha, Matthew Reiss, Sanjeev Sathe, Charles G. Woychik | 2003-10-28 |
| 6583517 | Method and structure for joining two substrates with a low melt solder joint | — | 2003-06-24 |
| 6558981 | Method for making an encapsulated semiconductor chip module | Marybeth Perrino, Son K. Tran, Tien Y. Wu | 2003-05-06 |
| 6528179 | Reduction of chip carrier flexing during thermal cycling | Lisa J. Jimarez | 2003-03-04 |
| 6524888 | Method of attaching a conformal chip carrier to a flip chip | David N. Cokely, Thomas M. Culnane, Lisa J. Jimarez, Li Li, Donald I. Mead | 2003-02-25 |