Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7328506 | Method for forming a plated microvia interconnect | Miguel A. Jimarez, Ross W. Keesler, Voya R. Markovich, Rajinder S. Rai | 2008-02-12 |
| 6887779 | Integrated circuit structure | David J. Alcoe, Francis J. Downes, Jr., Gerald W. Jones, John S. Kresge | 2005-05-03 |
| 6720502 | Integrated circuit structure | David J. Alcoe, Francis J. Downes, Jr., Gerald W. Jones, John S. Kresge | 2004-04-13 |
| 6538213 | High density design for organic chip carriers | Timothy F. Carden, Todd W. Davies, Ross W. Keesler, Robert David Sebesta, David B. Stone | 2003-03-25 |
| 6492600 | Laminate having plated microvia interconnects and method for forming the same | Miguel A. Jimarez, Ross W. Keesler, Voya R. Markovich, Rajinder S. Rai | 2002-12-10 |