Issued Patents All Time
Showing 25 most recent of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8240027 | Method of making circuitized substrates having film resistors as part thereof | Frank D. Egitto, John M. Lauffer | 2012-08-14 |
| 8198551 | Power core for use in circuitized substrate and method of making same | Robert M. Japp, Kostas Papathomas, Timothy Antesberger | 2012-06-12 |
| 7595454 | Method of making a circuitized substrate with enhanced circuitry and electrical assembly utilizing said substrate | Cheryl Palomaki | 2009-09-29 |
| 7163847 | Method of making circuitized substrate | Timothy Antesberger, James W. Fuller, John J. Konrad, Stephen Krasniak, Timothy L. Wells | 2007-01-16 |
| 7091066 | Method of making circuitized substrate | Timothy Antesberger, James W. Fuller, John J. Konrad, Stephen Krasniak, Timothy L. Wells | 2006-08-15 |
| 7084014 | Method of making circuitized substrate | Timothy Antesberger, James W. Fuller, John J. Konrad, Stephen Krasniak, Timothy L. Wells | 2006-08-01 |
| 7024764 | Method of making an electronic package | Robert David Sebesta, David B. Stone, James R. Wilcox | 2006-04-11 |
| 6998290 | Economical high density chip carrier | Sylvia Adae-Amoakoh, Voya R. Markovich, Thurston Bryce Youngs, Jr. | 2006-02-14 |
| 6958106 | Material separation to form segmented product | Timothy Antesberger | 2005-10-25 |
| 6887779 | Integrated circuit structure | David J. Alcoe, Francis J. Downes, Jr., Gerald W. Jones, Cheryl L. Tytran-Palomaki | 2005-05-03 |
| 6868604 | Method for forming an electrical structure | Voya R. Markovich | 2005-03-22 |
| 6829823 | Method of making a multi-layered interconnect structure | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more | 2004-12-14 |
| 6753612 | Economical high density chip carrier | Sylvia Adae-Amoakoh, Voya R. Markovich, Thurston Bryce Youngs, Jr. | 2004-06-22 |
| 6720502 | Integrated circuit structure | David J. Alcoe, Francis J. Downes, Jr., Gerald W. Jones, Cheryl L. Tytran-Palomaki | 2004-04-13 |
| 6693031 | Formation of a metallic interlocking structure | Gerald G. Advocate, Jr., Francis J. Downes, Jr., Luis J. Matienzo, Ronald A. Kaschak, Daniel C. Van Hart | 2004-02-17 |
| 6689543 | Laser ablatable material and its use | John M. Lauffer, David J. Russell | 2004-02-10 |
| 6562654 | Tented plated through-holes and method for fabrication thereof | David B. Stone, James R. Wilcox | 2003-05-13 |
| 6559388 | Strain relief for substrates having a low coefficient of thermal expansion | Voya R. Markovich | 2003-05-06 |
| 6509546 | Laser excision of laminate chip carriers | Frank D. Egitto | 2003-01-21 |
| 6483074 | Laser beam system for micro via formation | — | 2002-11-19 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more | 2002-04-16 |
| 6361923 | Laser ablatable material and its use | John M. Lauffer, David J. Russell | 2002-03-26 |
| 6351393 | Electronic package for electronic components and method of making same | Robert David Sebesta, David B. Stone, James R. Wilcox | 2002-02-26 |
| 6348737 | Metallic interlocking structure | Gerald G. Advocate, Jr., Francis J. Downes, Jr., Luis J. Matienzo, Ronald A. Kaschak, Daniel C. Van Hart | 2002-02-19 |
| 6341071 | Stress relieved ball grid array package | Eric A. Johnson | 2002-01-22 |