TW

Timothy L. Wells

IBM: 13 patents #8,581 of 70,183Top 15%
ET Endicott Interconnect Technologies: 4 patents #26 of 87Top 30%
BC Bae Systems Controls: 2 patents #25 of 124Top 25%
Overall (All Time): #235,571 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11300033 Method and system for a hybrid vehicle Derek Matthews 2022-04-12
10876457 Method and system for reducing emissions from an internal combustion engine Derek Matthews 2020-12-29
7425256 Selective shield/material flow mechanism Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer 2008-09-16
7288177 Selective shield/material flow mechanism Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer 2007-10-30
7169313 Plating method for circuitized substrates Norman A. Card, Robert D. Edwards, John J. Konrad, Roy H. Magnuson, Michael Wozniak 2007-01-30
7163847 Method of making circuitized substrate Timothy Antesberger, James W. Fuller, John J. Konrad, John S. Kresge, Stephen Krasniak 2007-01-16
7091066 Method of making circuitized substrate Timothy Antesberger, James W. Fuller, John J. Konrad, John S. Kresge, Stephen Krasniak 2006-08-15
7084014 Method of making circuitized substrate Timothy Antesberger, James W. Fuller, John J. Konrad, John S. Kresge, Stephen Krasniak 2006-08-01
7007378 Process for manufacturing a printed wiring board John G. Gaudiello, James D. Herard, John J. Konrad, Jeffrey McKeveny 2006-03-07
6931722 Method of fabricating printed circuit board with mixed metallurgy pads Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin Knadle, John J. Konrad +5 more 2005-08-23
6746578 Selective shield/material flow mechanism Ralph A. Barrese, Gary Gajdorus, Allen H. Hopkins, John J. Konrad, Robert C. Schaffer 2004-06-08
6586683 Printed circuit board with mixed metallurgy pads and method of fabrication Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin Knadle, John J. Konrad +5 more 2003-07-01
6485892 Method for masking a hole in a substrate during plating Lawrence Robert Blumberg, Norman A. Card, Richard A. Day, Stephen Joseph Fuerniss, John J. Konrad +1 more 2002-11-26
6455139 Process for reducing extraneous metal plating John J. Konrad, Konstantinos I. Papathomas, James Warren Wilson 2002-09-24
6429390 Structure and method for forming the same of a printed wiring board having built-in inspection aids Michael J. Cummings, Robert J. Lerner, Michael V. Longo, Andrew Seman, Raymond C. Tompkins 2002-08-06
6296897 Process for reducing extraneous metal plating John J. Konrad, Konstantinos I. Papathomas, James Warren Wilson 2001-10-02
6265075 Circuitized semiconductor structure and method for producing such David Anton Klueppel, Voya R. Markovich, Thomas R. Miller, William E. Wilson 2001-07-24
5893983 Technique for removing defects from a layer of metal John J. Konrad, Voya R. Markovich, George Frederick Reel, Jose A. Rios, Michael Wozniak 1999-04-13
5733466 Electrolytic method of depositing gold connectors on a printed circuit board Biebele Opubo Benebo, Edmund Glenn Benjamin, Robert D. Edwards, John J. Konrad, Jerzy M. Zalesinski 1998-03-31