| 7070909 |
UV absorbing glass cloth and use thereof |
Robert M. Japp, Pamela Lulkoski, Jan Obrzut, Kenneth Lynn Potter |
2006-07-04 |
| 7007378 |
Process for manufacturing a printed wiring board |
John G. Gaudiello, James D. Herard, John J. Konrad, Timothy L. Wells |
2006-03-07 |
| 6931722 |
Method of fabricating printed circuit board with mixed metallurgy pads |
Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin Knadle, John J. Konrad +5 more |
2005-08-23 |
| 6919514 |
Structure having laser ablated features and method of fabricating |
John J. Konrad, James Warren Wilson |
2005-07-19 |
| 6838400 |
UV absorbing glass cloth and use thereof |
Robert M. Japp, Pamela Lulkoski, Jan Obrzut, Kenneth Lynn Potter |
2005-01-04 |
| 6730857 |
Structure having laser ablated features and method of fabricating |
John J. Konrad, James Warren Wilson |
2004-05-04 |
| 6586683 |
Printed circuit board with mixed metallurgy pads and method of fabrication |
Edward Lee Arrington, Anilkumar C. Bhatt, Edmond O. Fey, Kevin Knadle, John J. Konrad +5 more |
2003-07-01 |
| 6485892 |
Method for masking a hole in a substrate during plating |
Lawrence Robert Blumberg, Norman A. Card, Richard A. Day, Stephen Joseph Fuerniss, John J. Konrad +1 more |
2002-11-26 |
| 6025057 |
Organic electronic package and method of applying palladium-tin seed layer thereto |
Anastasios Angelopoulos, Gerald W. Jones, Richard William Malek, Heike Marcello |
2000-02-15 |
| 5866237 |
Organic electronic package and method of applying palladium-tin seed layer thereto |
Anastasios Angelopoulos, Gerald W. Jones, Richard William Malek, Heike Marcello |
1999-02-02 |
| 5599747 |
Method of making circuitized substrate |
Ashwinkumar C. Bhatt, Thomas P. Duffy, David E. Houser, Gerald W. Jones, Kenneth Lynn Potter |
1997-02-04 |
| 5578796 |
Apparatus for laminating and circuitizing substrates having openings therein |
Ashwinkumar C. Bhatt, Thomas P. Duffy, Gerry A. Hackett |
1996-11-26 |
| 5542175 |
Method of laminating and circuitizing substrates having openings therein |
Ashwinkumar C. Bhatt, Thomas P. Duffy, Gerry A. Hackett |
1996-08-06 |
| 5229550 |
Encapsulated circuitized power core alignment and lamination |
Perminder S. Bindra, Dennis A. Canfield, Voya R. Markovich, Robert E. Ruane, Edwin L. Thomas |
1993-07-20 |
| 5129142 |
Encapsulated circuitized power core alignment and lamination |
Perminder S. Bindra, Dennis A. Canfield, Voya R. Markovich, Robert E. Ruane, Edwin L. Thomas |
1992-07-14 |
