| 8658066 |
Chemiluminescent powders and methods of making and using thereof |
Mark A. Kluttz, Reid Pannill, Shawn P. Hodgson |
2014-02-25 |
| 7964119 |
Chemiluminescent powders and methods of making and using thereof |
Mark A. Kluttz, Shawn P. Hodgson, Reid Pannill |
2011-06-21 |
| 7674406 |
Chemiluminescent compositions and methods of making and using thereof |
Andrew D. Burris, Carl R. Carlson, Joann M Smith, Orville Z Tyler, David Watson |
2010-03-09 |
| 5435057 |
Interconnection method and structure for organic circuit boards |
Ross Downey Havens, Voya R. Markovich, Jaynal A. Molla |
1995-07-25 |
| 5298685 |
Interconnection method and structure for organic circuit boards |
Ross Downey Havens, Voya R. Markovich, Jaynal A. Molla |
1994-03-29 |
| 5229550 |
Encapsulated circuitized power core alignment and lamination |
Dennis A. Canfield, Voya R. Markovich, Jeffrey McKeveny, Robert E. Ruane, Edwin L. Thomas |
1993-07-20 |
| 5185073 |
Method of fabricating nendritic materials |
Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang, Jungihl Kim +10 more |
1993-02-09 |
| 5137461 |
Separable electrical connection technology |
Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang, Jungihl Kim +10 more |
1992-08-11 |
| 5129142 |
Encapsulated circuitized power core alignment and lamination |
Dennis A. Canfield, Voya R. Markovich, Jeffrey McKeveny, Robert E. Ruane, Edwin L. Thomas |
1992-07-14 |
| 5048178 |
Alignment--registration tool for fabricating multi-layer electronic packages |
Peter Lueck, Eberhard H. Naegele |
1991-09-17 |
| 5035778 |
Regeneration of spent ferric chloride etchants |
Kathleen L. Covert, David N. Light |
1991-07-30 |
| 4969979 |
Direct electroplating of through holes |
Bernd Karl Appelt, Robert D. Edwards, James R. Loomis, Jae Man Park, Jonathan D. Reid +2 more |
1990-11-13 |
| 4910049 |
Conditioning a dielectric substrate for plating thereon |
Donald F. Canaperi, Allan P. David, David N. Light |
1990-03-20 |
| 4725339 |
Method for monitoring metal ion concentrations in plating baths |
Solomon L. Levine, David N. Light |
1988-02-16 |
| 4540473 |
Copper plating bath having increased plating rate, and method |
Allan P. David, Raymond T. Galasco, Charles E. Gasdik, David N. Light, Paul B. Pickar |
1985-09-10 |
| 4490219 |
Method of manufacture employing electrochemically dispersed platinum catalysts deposited on a substrate |
David N. Light |
1984-12-25 |
| 4479852 |
Method for determination of concentration of organic additive in plating bath |
Allan P. David, Raymond T. Galasco, David N. Light |
1984-10-30 |
| 4457986 |
Use of underpotential deposited layers of metals on foreign metal substrates as catalysts for electrolytic cells |
Allan P. David, David N. Light |
1984-07-03 |
| 4397730 |
Electrolytic cells with alkaline electrolytes containing trifluoromethylane sulfonic acid |
— |
1983-08-09 |
