| 11895777 |
Flexible inlay and manufacturing method thereof |
— |
2024-02-06 |
|
| 10776600 |
Electronic sensor supported on rigid substrate |
Fred G. Benkley, III, David Rodney Baker, Thomas Gaudette |
2020-09-15 |
|
| 10713461 |
Double sided sensor module suitable for integration into electronic devices |
Fred G. Benkley, III |
2020-07-14 |
|
| 10687424 |
Configurable, encapsulated sensor module and method for making same |
Fred G. Benkley, III, David Joseph Geoffroy, Massimo Eugenio Ravelli |
2020-06-16 |
|
| 10675791 |
Method of manufacturing a cover member suitable for a fingerprint sensor |
Anne L. McAleer |
2020-06-09 |
|
| 10387707 |
Reinforcement panel for fingerprint sensor cover |
David Rodney Baker |
2019-08-20 |
$41,955,000 |
| 10331934 |
Electronic sensor supported on rigid substrate |
Fred G. Benkley, III, David Rodney Baker, Thomas Gaudette |
2019-06-25 |
$25,258,000 |
| 9680273 |
Electrical connector with electrical contacts protected by a layer of compressible material and method of making it |
Hung-Ming Wang, David Rodney Baker, Peter Nguyen, Dexter Shih-Wei Pao |
2017-06-13 |
|
| 8641428 |
Electrical connector and method of making it |
Dinesh S. Kalakkad, Peter Nguyen |
2014-02-04 |
|
| 6734368 |
Metal backed printed circuit board assemblies |
Lisa J. Jimarez |
2004-05-11 |
$7,887,000 |
| 6178630 |
Conductive bonding design and method for aluminum backed circuits |
Lisa J. Jimarez, Andrew Seman, David B. Stone |
2001-01-30 |
$13,187,000 |
| 6066808 |
Multilayer circuit board having metallized patterns formed flush with a top surface thereof |
John S. Kresge |
2000-05-23 |
$39,585,000 |
| 5920037 |
Conductive bonding design for metal backed circuits |
Lisa J. Jimarez, Andrew Seman, David B. Stone |
1999-07-06 |
$40,075,000 |
| 5829124 |
Method for forming metallized patterns on the top surface of a printed circuit board |
John S. Kresge |
1998-11-03 |
$14,328,000 |
| 5736679 |
Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board |
John S. Kresge, James R. Wilcox |
1998-04-07 |
$12,123,000 |
| 5620782 |
Method of fabricating a flex laminate package |
Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias +2 more |
1997-04-15 |
$19,390,000 |
| 5574630 |
Laminated electronic package including a power/ground assembly |
John S. Kresge, Tien Y. Wu |
1996-11-12 |
$16,914,000 |
| 5509196 |
Method of fabricating a flex laminate package |
Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias +2 more |
1996-04-23 |
$15,192,000 |
| 5384690 |
Flex laminate package for a parallel processor |
Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias +2 more |
1995-01-24 |
$12,425,000 |
| 5221420 |
Etching method for increased circuitized line width and uniformity |
Kathleen L. Covert, Jennette E. Kingsley, Richard A. Schumacher |
1993-06-22 |
$8,462,000 |
| 5185073 |
Method of fabricating nendritic materials |
Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more |
1993-02-09 |
$9,865,000 |
| 5137461 |
Separable electrical connection technology |
Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more |
1992-08-11 |
$12,814,000 |
| 5035778 |
Regeneration of spent ferric chloride etchants |
Perminder S. Bindra, Kathleen L. Covert |
1991-07-30 |
$34,699,000 |
| 4910049 |
Conditioning a dielectric substrate for plating thereon |
Perminder S. Bindra, Donald F. Canaperi, Allan P. David |
1990-03-20 |
$24,041,000 |
| 4725339 |
Method for monitoring metal ion concentrations in plating baths |
Perminder S. Bindra, Solomon L. Levine |
1988-02-16 |
$22,273,000 |
