Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11895777 | Flexible inlay and manufacturing method thereof | — | 2024-02-06 |
| 10776600 | Electronic sensor supported on rigid substrate | Fred G. Benkley, III, David Rodney Baker, Thomas Gaudette | 2020-09-15 |
| 10713461 | Double sided sensor module suitable for integration into electronic devices | Fred G. Benkley, III | 2020-07-14 |
| 10687424 | Configurable, encapsulated sensor module and method for making same | Fred G. Benkley, III, David Joseph Geoffroy, Massimo Eugenio Ravelli | 2020-06-16 |
| 10675791 | Method of manufacturing a cover member suitable for a fingerprint sensor | Anne L. McAleer | 2020-06-09 |
| 10387707 | Reinforcement panel for fingerprint sensor cover | David Rodney Baker | 2019-08-20 |
| 10331934 | Electronic sensor supported on rigid substrate | Fred G. Benkley, III, David Rodney Baker, Thomas Gaudette | 2019-06-25 |
| 9680273 | Electrical connector with electrical contacts protected by a layer of compressible material and method of making it | Hung-Ming Wang, David Rodney Baker, Peter Nguyen, Dexter Shih-Wei Pao | 2017-06-13 |
| 8641428 | Electrical connector and method of making it | Dinesh S. Kalakkad, Peter Nguyen | 2014-02-04 |
| 6734368 | Metal backed printed circuit board assemblies | Lisa J. Jimarez | 2004-05-11 |
| 6178630 | Conductive bonding design and method for aluminum backed circuits | Lisa J. Jimarez, Andrew Seman, David B. Stone | 2001-01-30 |
| 6066808 | Multilayer circuit board having metallized patterns formed flush with a top surface thereof | John S. Kresge | 2000-05-23 |
| 5920037 | Conductive bonding design for metal backed circuits | Lisa J. Jimarez, Andrew Seman, David B. Stone | 1999-07-06 |
| 5829124 | Method for forming metallized patterns on the top surface of a printed circuit board | John S. Kresge | 1998-11-03 |
| 5736679 | Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board | John S. Kresge, James R. Wilcox | 1998-04-07 |
| 5620782 | Method of fabricating a flex laminate package | Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias +2 more | 1997-04-15 |
| 5574630 | Laminated electronic package including a power/ground assembly | John S. Kresge, Tien Y. Wu | 1996-11-12 |
| 5509196 | Method of fabricating a flex laminate package | Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias +2 more | 1996-04-23 |
| 5384690 | Flex laminate package for a parallel processor | Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias +2 more | 1995-01-24 |
| 5221420 | Etching method for increased circuitized line width and uniformity | Kathleen L. Covert, Jennette E. Kingsley, Richard A. Schumacher | 1993-06-22 |
| 5185073 | Method of fabricating nendritic materials | Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more | 1993-02-09 |
| 5137461 | Separable electrical connection technology | Perminder S. Bindra, Jerome J. Cuomo, Thomas P. Gall, Anthony P. Ingraham, Sung Kwon Kang +10 more | 1992-08-11 |
| 5035778 | Regeneration of spent ferric chloride etchants | Perminder S. Bindra, Kathleen L. Covert | 1991-07-30 |
| 4910049 | Conditioning a dielectric substrate for plating thereon | Perminder S. Bindra, Donald F. Canaperi, Allan P. David | 1990-03-20 |
| 4725339 | Method for monitoring metal ion concentrations in plating baths | Perminder S. Bindra, Solomon L. Levine | 1988-02-16 |