Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board

Deformable interconnect structure for connecting an internal plane to a through-hole in a multilayer circuit board

US Patent 5736679 · Granted Apr 7, 1998

Estimated economic value: $12,123,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible inlay and manufacturing method thereof2024
Electronic sensor supported on rigid substrate2020
Double sided sensor module suitable for integration into electronic devices2020
Configurable, encapsulated sensor module and method for making same2020
Method of manufacturing a cover member suitable for a fingerprint sensor2020
Method and system establishing a network connection2020
Reinforcement panel for fingerprint sensor cover2019
Electronic sensor supported on rigid substrate2019
Electrical connector with electrical contacts protected by a layer of compressib2017
Electrical connector and method of making it2014
Method of making circuitized substrates having film resistors as part thereof2012
Power core for use in circuitized substrate and method of making same2012