Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10609179 | Method and system establishing a network connection | Dritan Kaleshi, Mahesh SOORIYABANDARA | 2020-03-31 |
| 7255571 | Temperature dependent semiconductor module connectors | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Mitchell G. Ferrill, Robin A. Susko | 2007-08-14 |
| 7137826 | Temperature dependent semiconductor module connectors | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Mitchell G. Ferrill, Robin A. Susko | 2006-11-21 |
| 7128579 | Hook interconnect | William L. Brodsky, James A. Busby, Bruce J. Chamberlin, Mitchell G. Ferrill, Robin A. Susko | 2006-10-31 |
| 7083901 | Joining member for Z-interconnect in electronic devices without conductive paste | Frank D. Egitto, Voya R. Markovich, Thomas R. Miller, Douglas O. Powell | 2006-08-01 |
| 7024764 | Method of making an electronic package | John S. Kresge, Robert David Sebesta, David B. Stone | 2006-04-11 |
| 6829823 | Method of making a multi-layered interconnect structure | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more | 2004-12-14 |
| 6739046 | Method for producing dendrite interconnect for planarization | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer | 2004-05-25 |
| 6570261 | Method and apparatus for injection molded flip chip encapsulation | Donald S. Farquhar, Michael Joseph Klodowski, Konstantinos I. Papathomas | 2003-05-27 |
| 6562654 | Tented plated through-holes and method for fabrication thereof | John S. Kresge, David B. Stone | 2003-05-13 |
| 6427323 | Method for producing conductor interconnect with dendrites | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer | 2002-08-06 |
| 6410988 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson +1 more | 2002-06-25 |
| 6373717 | Electronic package with high density interconnect layer | Francis J. Downes, Jr., Donald S. Farquhar, Elizabeth Foster, Robert M. Japp, Gerald W. Jones +3 more | 2002-04-16 |
| 6369449 | Method and apparatus for injection molded flip chip encapsulation | Donald S. Farquhar, Michael Joseph Klodowski, Kostantinos Papathomas | 2002-04-09 |
| 6351393 | Electronic package for electronic components and method of making same | John S. Kresge, Robert David Sebesta, David B. Stone | 2002-02-26 |
| 6300575 | Conductor interconnect with dendrites through film | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer | 2001-10-09 |
| 6256874 | Conductor interconnect with dendrites through film and method for producing same | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer | 2001-07-10 |
| 6249045 | Tented plated through-holes and method for fabrication thereof | John S. Kresge, David B. Stone | 2001-06-19 |
| 6228470 | Composite substrate for electronic components | John S. Kresge | 2001-05-08 |
| 6104093 | Thermally enhanced and mechanically balanced flip chip package and method of forming | David V. Caletka, Jean Dery, Eric Duchesne, Michael A. Gaynes, Eric A. Johnson +1 more | 2000-08-15 |
| 6094059 | Apparatus and method for burn-in/testing of integrated circuit devices | Jerome A. Frankeny, Anthony P. Ingraham, James Steven Kamperman | 2000-07-25 |
| 6094060 | Test head for applying signals in a burn-in test of an integrated circuit | Jerome A. Frankeny, Anthony P. Ingraham, James Steven Kamperman | 2000-07-25 |
| 5993579 | High performance electrical cable and method of manufacture | Donald S. Farquhar, William L. Brodsky, Natalie B. Feilchenfeld, Lisa J. Jimarez | 1999-11-30 |
| 5981312 | Method for injection molded flip chip encapsulation | Donald S. Farquhar, Michael Joseph Klodowski, Konstantinos I. Papathomas | 1999-11-09 |
| 5977642 | Dendrite interconnect for planarization and method for producing same | Bernd Karl Appelt, Saswati Datta, Michael A. Gaynes, John M. Lauffer | 1999-11-02 |