| 7329816 |
Electronic package with optimized lamination process |
Donald S. Farquhar, James D. Herard, David L. Questad, Der-jin Woan |
2008-02-12 |
| 7240430 |
Manufacturing methods for printed circuit boards |
Bernd Karl Appelt, James R. Bupp, Donald S. Farquhar, Ross W. Keesler, Andrew Seman +1 more |
2007-07-10 |
| 7063756 |
Enhanced design and process for a conductive adhesive |
Donald S. Farquhar, Gerald Paul Kohut, Andrew Seman |
2006-06-20 |
| 7059049 |
Electronic package with optimized lamination process |
Donald S. Farquhar, James D. Herard, David L. Questad, Der-jin Woan |
2006-06-13 |
| 6902869 |
Manufacturing methods for printed circuit boards |
Bernd Karl Appelt, James R. Bupp, Donald S. Farquhar, Ross W. Keesler, Andrew Seman +1 more |
2005-06-07 |
| 6843929 |
Accelerated etching of chromium |
Donald S. Farquhar, Edmond O. Fey, Elizabeth Foster, Paul George Rickerl |
2005-01-18 |
| 6684497 |
Manufacturing methods for printed circuit boards |
Bernd Karl Appelt, James R. Bupp, Donald S. Farquhar, Ross W. Keesler, Andrew Seman +1 more |
2004-02-03 |
| 6675852 |
Platen for use in laminating press |
Varaprasad V. Calmidi, Donald S. Farquhar, Randall J. Stutzman |
2004-01-13 |
| 6570261 |
Method and apparatus for injection molded flip chip encapsulation |
Donald S. Farquhar, Konstantinos I. Papathomas, James R. Wilcox |
2003-05-27 |
| 6534724 |
Enhanced design and process for a conductive adhesive |
Donald S. Farquhar, Gerard Paul Kohut, Andrew Seman |
2003-03-18 |
| 6503821 |
Integrated circuit chip carrier assembly |
Donald S. Farquhar, Lisa J. Jimarez, Jeffrey Zimmerman |
2003-01-07 |
| 6395998 |
Electronic package having an adhesive retaining cavity |
Donald S. Farquhar, Gregory Kevern |
2002-05-28 |
| 6369449 |
Method and apparatus for injection molded flip chip encapsulation |
Donald S. Farquhar, Kostantinos Papathomas, James R. Wilcox |
2002-04-09 |
| 6335495 |
Patterning a layered chrome-copper structure disposed on a dielectric substrate |
Donald S. Farquhar, Edmond O. Fey, Elizabeth Foster |
2002-01-01 |
| 6329713 |
Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate |
Donald S. Farquhar, Lisa J. Jimarez, Jeffrey Zimmerman |
2001-12-11 |
| 6222136 |
Printed circuit board with continuous connective bumps |
Bernd Karl Appelt, James R. Bupp, Donald S. Farquhar, Ross W. Keesler, Andrew Seman +1 more |
2001-04-24 |
| 6214525 |
Printed circuit board with circuitized cavity and methods of producing same |
Christina M. Boyko, Donald S. Farquhar, Robert M. Japp |
2001-04-10 |
| 6066386 |
Printed circuit board with cavity for circuitization |
Christina M. Boyko, Donald S. Farquhar, Robert M. Japp |
2000-05-23 |
| 6015520 |
Method for filling holes in printed wiring boards |
Bernd Karl Appelt, Christina M. Boyko, Donald S. Farquhar, Stephen Joseph Fuerniss |
2000-01-18 |
| 5981312 |
Method for injection molded flip chip encapsulation |
Donald S. Farquhar, Konstantinos I. Papathomas, James R. Wilcox |
1999-11-09 |
| 5784782 |
Method for fabricating printed circuit boards with cavities |
Christina M. Boyko, Donald S. Farquhar, Robert M. Japp |
1998-07-28 |
