Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7329816 | Electronic package with optimized lamination process | Donald S. Farquhar, James D. Herard, David L. Questad, Der-jin Woan | 2008-02-12 |
| 7240430 | Manufacturing methods for printed circuit boards | Bernd Karl Appelt, James R. Bupp, Donald S. Farquhar, Ross W. Keesler, Andrew Seman +1 more | 2007-07-10 |
| 7063756 | Enhanced design and process for a conductive adhesive | Donald S. Farquhar, Gerald Paul Kohut, Andrew Seman | 2006-06-20 |
| 7059049 | Electronic package with optimized lamination process | Donald S. Farquhar, James D. Herard, David L. Questad, Der-jin Woan | 2006-06-13 |
| 6902869 | Manufacturing methods for printed circuit boards | Bernd Karl Appelt, James R. Bupp, Donald S. Farquhar, Ross W. Keesler, Andrew Seman +1 more | 2005-06-07 |
| 6843929 | Accelerated etching of chromium | Donald S. Farquhar, Edmond O. Fey, Elizabeth Foster, Paul George Rickerl | 2005-01-18 |
| 6684497 | Manufacturing methods for printed circuit boards | Bernd Karl Appelt, James R. Bupp, Donald S. Farquhar, Ross W. Keesler, Andrew Seman +1 more | 2004-02-03 |
| 6675852 | Platen for use in laminating press | Varaprasad V. Calmidi, Donald S. Farquhar, Randall J. Stutzman | 2004-01-13 |
| 6570261 | Method and apparatus for injection molded flip chip encapsulation | Donald S. Farquhar, Konstantinos I. Papathomas, James R. Wilcox | 2003-05-27 |
| 6534724 | Enhanced design and process for a conductive adhesive | Donald S. Farquhar, Gerard Paul Kohut, Andrew Seman | 2003-03-18 |
| 6503821 | Integrated circuit chip carrier assembly | Donald S. Farquhar, Lisa J. Jimarez, Jeffrey Zimmerman | 2003-01-07 |
| 6395998 | Electronic package having an adhesive retaining cavity | Donald S. Farquhar, Gregory Kevern | 2002-05-28 |
| 6369449 | Method and apparatus for injection molded flip chip encapsulation | Donald S. Farquhar, Kostantinos Papathomas, James R. Wilcox | 2002-04-09 |
| 6335495 | Patterning a layered chrome-copper structure disposed on a dielectric substrate | Donald S. Farquhar, Edmond O. Fey, Elizabeth Foster | 2002-01-01 |
| 6329713 | Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate | Donald S. Farquhar, Lisa J. Jimarez, Jeffrey Zimmerman | 2001-12-11 |
| 6222136 | Printed circuit board with continuous connective bumps | Bernd Karl Appelt, James R. Bupp, Donald S. Farquhar, Ross W. Keesler, Andrew Seman +1 more | 2001-04-24 |
| 6214525 | Printed circuit board with circuitized cavity and methods of producing same | Christina M. Boyko, Donald S. Farquhar, Robert M. Japp | 2001-04-10 |
| 6066386 | Printed circuit board with cavity for circuitization | Christina M. Boyko, Donald S. Farquhar, Robert M. Japp | 2000-05-23 |
| 6015520 | Method for filling holes in printed wiring boards | Bernd Karl Appelt, Christina M. Boyko, Donald S. Farquhar, Stephen Joseph Fuerniss | 2000-01-18 |
| 5981312 | Method for injection molded flip chip encapsulation | Donald S. Farquhar, Konstantinos I. Papathomas, James R. Wilcox | 1999-11-09 |
| 5784782 | Method for fabricating printed circuit boards with cavities | Christina M. Boyko, Donald S. Farquhar, Robert M. Japp | 1998-07-28 |