| 7240430 |
Manufacturing methods for printed circuit boards |
Bernd Karl Appelt, Donald S. Farquhar, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more |
2007-07-10 |
| 6902869 |
Manufacturing methods for printed circuit boards |
Bernd Karl Appelt, Donald S. Farquhar, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more |
2005-06-07 |
| 6684497 |
Manufacturing methods for printed circuit boards |
Bernd Karl Appelt, Donald S. Farquhar, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more |
2004-02-03 |
| 6639155 |
High performance packaging platform and method of making same |
Donald S. Farquhar, Lisa J. Jimarez |
2003-10-28 |
| 6222136 |
Printed circuit board with continuous connective bumps |
Bernd Karl Appelt, Donald S. Farquhar, Ross W. Keesler, Michael Joseph Klodowski, Andrew Seman +1 more |
2001-04-24 |
| 5773884 |
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto |
Frank E. Andros, Michael DiPietro, Richard B. Hammer |
1998-06-30 |
| 5633533 |
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto |
Frank E. Andros, Michael DiPietro, Richard B. Hammer |
1997-05-27 |
| 5561323 |
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto |
Frank E. Andros, Michael DiPietro, Richard B. Hammer |
1996-10-01 |
| 5519936 |
Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto |
Frank E. Andros, Michael DiPietro, Richard B. Hammer |
1996-05-28 |
| 4554182 |
Method for conditioning a surface of a dielectric substrate for electroless plating |
Gary K. Lemon, Voya R. Markovich, Carlos J. Sambucetti, Stephen L. Tisdale, Donna Jean Trevitt |
1985-11-19 |
| 4478883 |
Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate |
Voya R. Markovich, Tracy E. Napp, Carlos J. Sambucetti |
1984-10-23 |
| 4400618 |
Method of detecting and analyzing damage in printed circuit boards |
Lawrence R. Maier |
1983-08-23 |
