MD

Michael DiPietro

IBM: 5 patents #18,733 of 70,183Top 30%
DR Denning Mobile Robotics: 1 patents #8 of 14Top 60%
Lsi Logic: 1 patents #1,146 of 1,957Top 60%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
Overall (All Time): #744,315 of 4,157,543Top 20%
7
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8496398 Rebar sleeve unit 2013-07-30
5808474 Test socket for testing integrated circuit packages James W. Hively 1998-09-15
5773884 Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto Frank E. Andros, James R. Bupp, Richard B. Hammer 1998-06-30
5633533 Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto Frank E. Andros, James R. Bupp, Richard B. Hammer 1997-05-27
5561323 Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto Frank E. Andros, James R. Bupp, Richard B. Hammer 1996-10-01
5519936 Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto Frank E. Andros, James R. Bupp, Richard B. Hammer 1996-05-28
4777416 Recharge docking system for mobile robot Robert W. George, II, Mark B. Kadonoff, James F. Maddox 1988-10-11