Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5970321 | Method of fabricating a microelectronic package having polymer ESD protection | — | 1999-10-19 |
| 5955762 | Microelectronic package with polymer ESD protection | — | 1999-09-21 |
| 5869869 | Microelectronic device with thin film electrostatic discharge protection structure | — | 1999-02-09 |
| 5808474 | Test socket for testing integrated circuit packages | Michael DiPietro | 1998-09-15 |
| 5799080 | Semiconductor chip having identification/encryption code | Gobi R. Padmanabhan, Joseph M. Zelayeta, Visvamohan Yegnashankaran, John Daane | 1998-08-25 |
| 5691949 | Very high density wafer scale device architecture | Mammen Thomas, Richard L. Bechtel | 1997-11-25 |
| 5514884 | Very high density wafer scale device architecture | Mammen Thomas, Richard L. Bechtel | 1996-05-07 |
| 5315130 | Very high density wafer scale device architecture | Mammen Thomas, Richard L. Bechtel | 1994-05-24 |
| 5252507 | Very high density wafer scale device architecture | Mammen Thomas, Richard L. Bechtel | 1993-10-12 |
| 5223741 | Package for an integrated circuit structure | Richard L. Bechtel, Mammen Thomas | 1993-06-29 |
| 5182632 | High density multichip package with interconnect structure and heatsink | Richard L. Bechtel, Mammen Thomas | 1993-01-26 |