Issued Patents All Time
Showing 1–25 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9941886 | Integrated circuit (IC) chip comprising an identification circuit | Jimmy Yong Xiao, Surendra Kumar Rathaur | 2018-04-10 |
| 9768781 | Identification circuit and IC chip comprising the same | Jimmy Yong Xiao, Surendra Kumar Rathaur | 2017-09-19 |
| 8303484 | Self-propelled robotic device that moves through bodily and other passageways | Peter J. Hopper, Philipp Lindorfer, William French | 2012-11-06 |
| 8288834 | Semiconductor wafer and die that include an integrated circuit and two or more different MEMS-based semiconductor devices | Gobi R. Padmanabhan | 2012-10-16 |
| 8198150 | Method of forming a semiconductor die with aluminum-spiked heat pipes | — | 2012-06-12 |
| 7996034 | Cellular telephone handset with increased reception sensitivity and reduced transmit power levels | Ahmad Bahai | 2011-08-09 |
| 7863644 | Bipolar transistor and method of forming the bipolar transistor with a backside contact | Hengyang James Lin | 2011-01-04 |
| 7790602 | Method of forming a metal interconnect with capacitive structures that adjust the capacitance of the interconnect | Gobi R. Padmanabhan | 2010-09-07 |
| 7764517 | Power supply with reduced power consumption when a load is disconnected from the power supply | Peter J. Hopper | 2010-07-27 |
| 7754502 | Backside defect detector and method that determines whether unwanted materials are present on the backside of a semiconductor wafer | — | 2010-07-13 |
| 7705421 | Semiconductor die with an integrated inductor | — | 2010-04-27 |
| 7646064 | Semiconductor die with aluminum-spiked heat pipes | — | 2010-01-12 |
| 7633131 | MEMS semiconductor sensor device | Gobi R. Padmanabhan | 2009-12-15 |
| 7482228 | Method of forming a MOS transistor with a litho-less gate | Gobi R. Padmanabhan | 2009-01-27 |
| 7338840 | Method of forming a semiconductor die with heat and electrical pipes | Gobi R. Padmanabhan | 2008-03-04 |
| 7329555 | Method of selectively forming MEMS-based semiconductor devices at the end of a common fabrication process | Gobi R. Padmanabhan | 2008-02-12 |
| 7230301 | Single-crystal silicon semiconductor structure | Gobi R. Padmanabhan | 2007-06-12 |
| 7192819 | Semiconductor sensor device using MEMS technology | Gobi R. Padmanabhan | 2007-03-20 |
| 7188044 | World-wide distributed testing for integrated circuits | Hengyang James Lin | 2007-03-06 |
| 7109571 | Method of forming a hermetic seal for silicon die with metal feed through structure | Gobi R. Padmanabhan | 2006-09-19 |
| 7098095 | Method of forming a MOS transistor with a layer of silicon germanium carbon | Abdalla Aly Naem | 2006-08-29 |
| 7075133 | Semiconductor die with heat and electrical pipes | Gobi R. Padmanabhan | 2006-07-11 |
| 7052977 | Method of dicing a semiconductor wafer that substantially reduces the width of the saw street | Gobi R. Padmanabhan | 2006-05-30 |
| 7042092 | Multilevel metal interconnect and method of forming the interconnect with capacitive structures that adjust the capacitance of the interconnect | Gobi R. Padmanabhan | 2006-05-09 |
| 6949421 | Method of forming a vertical MOS transistor | Gobi R. Padmanabhan | 2005-09-27 |