Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6483708 | Heatsink apparatus for de-coupling clamping forces on an integrated circuit package | Hassan Ali | 2002-11-19 |
| 6459582 | Heatsink apparatus for de-coupling clamping forces on an integrated circuit package | Hassan Ali | 2002-10-01 |
| 6150199 | Method for fabrication of programmable interconnect structure | Ralph G. Whitten, Mammen Thomas, Hua-Thye Chua, Andrew K. Chan, John Birkner | 2000-11-21 |
| 5989943 | Method for fabrication of programmable interconnect structure | Ralph G. Whitten, Mammen Thomas, Hua-Thye Chua, Andrew K. Chan, John Birkner | 1999-11-23 |
| 5780919 | Electrically programmable interconnect structure having a PECVD amorphous silicon element | Hua-Thye Chua, Andrew K. Chan, John Birkner, Ralph G. Whitten, Mammen Thomas | 1998-07-14 |
| 5717230 | Field programmable gate array having reproducible metal-to-metal amorphous silicon antifuses | Hua-Thye Chua, Andrew K. Chan, John Birkner, Ralph G. Whitten, Mammen Thomas | 1998-02-10 |
| 5691949 | Very high density wafer scale device architecture | James W. Hively, Mammen Thomas | 1997-11-25 |
| 5514884 | Very high density wafer scale device architecture | James W. Hively, Mammen Thomas | 1996-05-07 |
| 5502315 | Electrically programmable interconnect structure having a PECVD amorphous silicon element | Hua-Thye Chua, Andrew K. Chan, John Birkner, Ralph G. Whitten, Mammen Thomas | 1996-03-26 |
| 5371991 | Re-bar clamp assembly | Don Needham | 1994-12-13 |
| 5315130 | Very high density wafer scale device architecture | James W. Hively, Mammen Thomas | 1994-05-24 |
| 5252507 | Very high density wafer scale device architecture | James W. Hively, Mammen Thomas | 1993-10-12 |
| 5223741 | Package for an integrated circuit structure | Mammen Thomas, James W. Hively | 1993-06-29 |
| 5182632 | High density multichip package with interconnect structure and heatsink | Mammen Thomas, James W. Hively | 1993-01-26 |
| 4836861 | Solar cell and cell mount | Douglas L. Peltzer, Wen C. Ko, William T. Liggett | 1989-06-06 |