Issued Patents All Time
Showing 1–25 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7880305 | Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer | Yu-Ting Cheng, Sherif A. Goma, John Harold Magerlein, Sampath Purushothaman, George F. Walker | 2011-02-01 |
| 7825516 | Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures | Stefanie Chiras, Michael Lane, Sandra G. Malhotra, Fenton R. Mc Feely, Robert Rosenberg +1 more | 2010-11-02 |
| 7468320 | Reduced electromigration and stressed induced migration of copper wires by surface coating | Chao-Kun Hu, Robert Rosenberg, Judith M. Rubino, Anthony K. Stamper | 2008-12-23 |
| 7273803 | Ball limiting metallurgy, interconnection structure including the same, and method of forming an interconnection structure | Yu-Ting Cheng, Stefanie Chiras, Donald W. Henderson, Sung Kwon Kang, Stephen Kilpatrick +2 more | 2007-09-25 |
| 7081680 | Self-aligned corrosion stop for copper C4 and wirebond | Daniel C. Edelstein, Anthony K. Stamper, Judith M. Rubino | 2006-07-25 |
| 7033648 | Means of seeding and metallizing polyimide | Fuad E. Doany, Jeffrey R. Marino, Ravi F. Saraf | 2006-04-25 |
| 6819000 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Kevin S. Petrarca, Sampath Purushothaman, Richard P. Volant, George F. Walker | 2004-11-16 |
| 6779711 | Self-aligned corrosion stop for copper C4 and wirebond | Daniel C. Edelstein, Anthony K. Stamper, Judith M. Rubino | 2004-08-24 |
| 6747472 | Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same | John Harold Magerlein, Samuel McKnight, Kevin S. Petrarca, Sampath Purushothaman, Joseph J. Van Horn +2 more | 2004-06-08 |
| 6732908 | High density raised stud microjoining system and methods of fabricating the same | Bruce K. Furman, Maheswaran Surendra, Sherif A. Goma, Simon Karecki, John Harold Magerlein +4 more | 2004-05-11 |
| 6661098 | High density area array solder microjoining interconnect structure and fabrication method | John Harold Magerlein, Kevin S. Petrarca, Sampath Purushothaman, Richard P. Volant, George F. Walker | 2003-12-09 |
| 6656750 | Method for testing chips on flat solder bumps | Madhav Datta, Peter A. Gruber, Judith M. Rubino, George F. Walker | 2003-12-02 |
| 6646345 | Method for forming Co-W-P-Au films | Judith M. Rubino, Daniel C. Edelstein, Cyryl Cabral, Jr., George F. Walker, John G. Gaudiello +1 more | 2003-11-11 |
| 6573606 | Chip to wiring interface with single metal alloy layer applied to surface of copper interconnect | Xiaomeng Chen, Soon-Cheon Seo, Birenda Nath Agarwala, Chao-Kun Hu, Naftali E. Lustig +1 more | 2003-06-03 |
| 6566612 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Michael Liehr | 2003-05-20 |
| 6503834 | Process to increase reliability CuBEOL structures | Xiaomeng Chen, Mahadevaiyer Krishnan, Judith M. Rubino, Soon-Cheon Seo, James A. Tornello | 2003-01-07 |
| 6457234 | Process for manufacturing self-aligned corrosion stop for copper C4 and wirebond | Daniel C. Edelstein, Judith M. Rubino, Anthony K. Stamper | 2002-10-01 |
| 6436803 | Manufacturing computer systems with fine line circuitized substrates | Anilkumar C. Bhatt, Roy H. Magnuson, Thomas R. Miller, Voya R. Markovich, Stephen L. Tisdale | 2002-08-20 |
| 6358832 | Method of forming barrier layers for damascene interconnects | Daniel C. Edelstein, Timothy J. Dalton, John G. Gaudiello, Mahadevaiyer Krishnan, Sandra G. Malhotra +2 more | 2002-03-19 |
| 6341418 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Michael Liehr | 2002-01-29 |
| 6342733 | Reduced electromigration and stressed induced migration of Cu wires by surface coating | Chao-Kun Hu, Robert Rosenberg, Judith M. Rubino, Anthony K. Stamper | 2002-01-29 |
| 6340630 | Method for making interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey +2 more | 2002-01-22 |
| 6339024 | Reinforced integrated circuits | Kevin S. Petrarca, John E. Heidenreich, III, Judith M. Rubino, Richard P. Volant, George F. Walker | 2002-01-15 |
| 6335104 | Method for preparing a conductive pad for electrical connection and conductive pad formed | Daniel C. Edelstein, John G. Gaudiello, Judith M. Rubino, George F. Walker | 2002-01-01 |
| 6332569 | Etched glass solder bump transfer for flip chip integrated circuit devices | Steven A. Cordes, Peter A. Gruber, Egon Max Kummer, Stephen Roux, James L. Speidell | 2001-12-25 |