Issued Patents All Time
Showing 26–50 of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6323128 | Method for forming Co-W-P-Au films | Judith M. Rubino, Daniel C. Edelstein, Cyryl Cabral, Jr., George F. Walker, John G. Gaudiello +1 more | 2001-11-27 |
| 6281105 | Electrode modification using an unzippable polymer paste | John M. Cotte, Judith Marie Roldan, Ravi F. Saraf | 2001-08-28 |
| 6268016 | Manufacturing computer systems with fine line circuitized substrates | Anilkumar C. Bhatt, Roy H. Magnuson, Thomas R. Miller, Voya R. Markovich, Stephen L. Tisdale | 2001-07-31 |
| 6221503 | Electrode modification using an unzippable polymer paste | John M. Cotte, Judith Marie Roldan, Ravi F. Saraf | 2001-04-24 |
| 6197222 | Lead free conductive composites for electrical interconnections | Ravi F. Saraf, Judith Marie Roldan, Michael A. Gaynes, Richard B. Booth, Steven P. Ostrander +1 more | 2001-03-06 |
| 6153935 | Dual etch stop/diffusion barrier for damascene interconnects | Daniel C. Edelstein, Timothy J. Dalton, John G. Gaudiello, Mahadevaiyer Krishnan, Sandra G. Malhotra +2 more | 2000-11-28 |
| 6149122 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel +2 more | 2000-11-21 |
| 6133633 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel +2 more | 2000-10-17 |
| 6127735 | Interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey +2 more | 2000-10-03 |
| 6105852 | Etched glass solder bump transfer for flip chip integrated circuit devices | Steven A. Cordes, Peter A. Gruber, Egon Max Kummer, Stephen Roux, James L. Speidell | 2000-08-22 |
| 6099939 | Enhanced adhesion between a vapor deposited metal and an organic polymer surface exhibiting tailored morphology | Kashmiri L. Mittal, Judith Marie Roldan, Ravi F. Saraf | 2000-08-08 |
| 6013713 | Electrode modification using an unzippable polymer paste | John M. Cotte, Judith Marie Roldan, Ravi F. Saraf | 2000-01-11 |
| 5897336 | Direct chip attach for low alpha emission interconnect system | Guy Paul Brouillette, David Danovitch, Michael Liehr, William T. Motsiff, Judith Marie Roldan +1 more | 1999-04-27 |
| 5866044 | Lead free conductive composites for electrical interconnections | Ravi F. Saraf, Judith Marie Roldan, Michael A. Gaynes, Richard B. Booth, Steven P. Ostrander +1 more | 1999-02-02 |
| 5775569 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel +2 more | 1998-07-07 |
| 5755859 | Cobalt-tin alloys and their applications for devices, chip interconnections and packaging | Vlasta Brusic, Jeffrey R. Marino, Eugene J. O'Sullivan, Alejandro G. Schrott, Cyprian Emeka Uzoh | 1998-05-26 |
| 5545429 | Fabrication of double side fully metallized plated thru-holes, in polymer structures, without seeding or photoprocess | Richard B. Booth, Emanuel I. Cooper, Edward A. Giess, Mark R. Kordus, Sol Krongelb +3 more | 1996-08-13 |
| 5509557 | Depositing a conductive metal onto a substrate | Lisa J. Jimarez, William H. Lawrence, Voya R. Markovich, Robert J. Owen | 1996-04-23 |
| 5310580 | Electroless metal adhesion to organic dielectric material with phase separated morphology | Eugene J. O'Sullivan, Terrence R. O'Toole, Judith Marie Roldan, Lubomyr T. Romankiw, Ravi F. Saraf | 1994-05-10 |
| 5190463 | High performance metal cone contact | Madhav Datta, David E. King, Alan D. Knight | 1993-03-02 |
| 5105537 | Method for making a detachable electrical contact | Madhav Datta, David E. King, Alan D. Knight | 1992-04-21 |
| 5079070 | Repair of open defects in thin film conductors | Pedro A. Chalco | 1992-01-07 |
| 4948707 | Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon | Robert W. Johnson, William H. Lawrence, Gary K. Lemon, Roy H. Magnuson, Voya R. Markovich +1 more | 1990-08-14 |
| 4820643 | Process for determining the activity of a palladium-tin catalyst | William J. Amelio, Kenneth R. Czarnecki, Gary K. Lemon, Voya R. Markovich, Richard Stuart Zarr | 1989-04-11 |
| 4654126 | Process for determining the plating activity of an electroless plating bath | William J. Amelio, Voya R. Markovich, Donna Jean Trevitt | 1987-03-31 |