| 8162199 |
Mold shave apparatus and injection molded soldering process |
Eric E. Bourchard, David Danovitch, Peter A. Gruber, Jean-Luc Landreville |
2012-04-24 |
| 7070087 |
Method and apparatus for transferring solder bumps |
David Danovitch, Jean-Paul Henry |
2006-07-04 |
| 6566612 |
Method for direct chip attach by solder bumps and an underfill layer |
David Danovitch, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti |
2003-05-20 |
| 6527158 |
Method and apparatus for forming solder bumps |
Peter A. Gruber, Frederic Maurer |
2003-03-04 |
| 6394334 |
Method and apparatus for forming solder bumps |
Peter A. Gruber, Frederic Maurer |
2002-05-28 |
| 6341418 |
Method for direct chip attach by solder bumps and an underfill layer |
David Danovitch, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti |
2002-01-29 |
| 6340630 |
Method for making interconnect for low temperature chip attachment |
Daniel G. Berger, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more |
2002-01-22 |
| 6276596 |
Low temperature solder column attach by injection molded solder and structure formed |
Peter A. Gruber, Lannie R. Bolde, James H. Covell, David Danovitch, Chon Cheong Lei |
2001-08-21 |
| 6149122 |
Method for building interconnect structures by injection molded solder and structures built |
Daniel G. Berger, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more |
2000-11-21 |
| 6133633 |
Method for building interconnect structures by injection molded solder and structures built |
Daniel G. Berger, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more |
2000-10-17 |
| 6127735 |
Interconnect for low temperature chip attachment |
Daniel G. Berger, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more |
2000-10-03 |
| 6056191 |
Method and apparatus for forming solder bumps |
Peter A. Gruber, Frederic Maurer |
2000-05-02 |
| 6003757 |
Apparatus for transferring solder bumps and method of using |
Guy D. Beaumont, David Danovitch, Peter A. Gruber |
1999-12-21 |
| 5897336 |
Direct chip attach for low alpha emission interconnect system |
David Danovitch, Michael Liehr, William T. Motsiff, Judith Marie Roldan, Carlos J. Sambucetti +1 more |
1999-04-27 |
| 5775569 |
Method for building interconnect structures by injection molded solder and structures built |
Daniel G. Berger, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more |
1998-07-07 |
