Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8162199 | Mold shave apparatus and injection molded soldering process | Eric E. Bourchard, David Danovitch, Peter A. Gruber, Jean-Luc Landreville | 2012-04-24 |
| 7070087 | Method and apparatus for transferring solder bumps | David Danovitch, Jean-Paul Henry | 2006-07-04 |
| 6566612 | Method for direct chip attach by solder bumps and an underfill layer | David Danovitch, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti | 2003-05-20 |
| 6527158 | Method and apparatus for forming solder bumps | Peter A. Gruber, Frederic Maurer | 2003-03-04 |
| 6394334 | Method and apparatus for forming solder bumps | Peter A. Gruber, Frederic Maurer | 2002-05-28 |
| 6341418 | Method for direct chip attach by solder bumps and an underfill layer | David Danovitch, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti | 2002-01-29 |
| 6340630 | Method for making interconnect for low temperature chip attachment | Daniel G. Berger, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more | 2002-01-22 |
| 6276596 | Low temperature solder column attach by injection molded solder and structure formed | Peter A. Gruber, Lannie R. Bolde, James H. Covell, David Danovitch, Chon Cheong Lei | 2001-08-21 |
| 6149122 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more | 2000-11-21 |
| 6133633 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more | 2000-10-17 |
| 6127735 | Interconnect for low temperature chip attachment | Daniel G. Berger, David Danovitch, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more | 2000-10-03 |
| 6056191 | Method and apparatus for forming solder bumps | Peter A. Gruber, Frederic Maurer | 2000-05-02 |
| 6003757 | Apparatus for transferring solder bumps and method of using | Guy D. Beaumont, David Danovitch, Peter A. Gruber | 1999-12-21 |
| 5897336 | Direct chip attach for low alpha emission interconnect system | David Danovitch, Michael Liehr, William T. Motsiff, Judith Marie Roldan, Carlos J. Sambucetti +1 more | 1999-04-27 |
| 5775569 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, David Danovitch, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more | 1998-07-07 |