Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10679966 | Gallium liquid metal embrittlement for device rework | Yolande Elodie Nguena Dongmo, Richard Langlois | 2020-06-09 |
| 10559549 | Gallium liquid metal embrittlement for device rework | Yolande Elodie Nguena Dongmo, Richard Langlois | 2020-02-11 |
| 8689437 | Method for forming integrated circuit assembly | Bing Dang, Mario J. Interrante, John U. Knickerbocker, Michael J. Shapiro, Van Thanh Truong | 2014-04-08 |
| 8162199 | Mold shave apparatus and injection molded soldering process | Eric E. Bourchard, Guy Paul Brouillette, Peter A. Gruber, Jean-Luc Landreville | 2012-04-24 |
| 7819376 | Techniques for forming interconnects | Mukta G. Farooq, Peter A. Gruber, John U. Knickerbocker, George R. Proto, Da-Yuan Shih | 2010-10-26 |
| 7348270 | Techniques for forming interconnects | Mukta G. Farooq, Peter A. Gruber, John U. Knickerbocker, George R. Proto, Da-Yuan Shih | 2008-03-25 |
| 7070087 | Method and apparatus for transferring solder bumps | Guy Paul Brouillette, Jean-Paul Henry | 2006-07-04 |
| 7038462 | Method and apparatus for electrical commoning of circuits | Richard Langlois, Martin Lapointe, Robert-Paul Leclerc | 2006-05-02 |
| 6832747 | Hybrid molds for molten solder screening process | Steven A. Cordes, Peter A. Gruber, James L. Speidell, Joseph Zinter | 2004-12-21 |
| 6566612 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti | 2003-05-20 |
| 6390439 | Hybrid molds for molten solder screening process | Steven A. Cordes, Peter A. Gruber, James L. Speidell, Joseph Zinter | 2002-05-21 |
| 6341418 | Method for direct chip attach by solder bumps and an underfill layer | Guy Paul Brouillette, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti | 2002-01-29 |
| 6340630 | Method for making interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more | 2002-01-22 |
| 6276596 | Low temperature solder column attach by injection molded solder and structure formed | Peter A. Gruber, Lannie R. Bolde, Guy Paul Brouillette, James H. Covell, Chon Cheong Lei | 2001-08-21 |
| 6149122 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more | 2000-11-21 |
| 6133633 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more | 2000-10-17 |
| 6127735 | Interconnect for low temperature chip attachment | Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Bruce Lee Humphrey, Michael Liehr +2 more | 2000-10-03 |
| 6112976 | Method of manufacturing wire segments of homogeneous composition | Louis-Marie Achard, Claude Blais, Jean-Francois Garneau, Michel Robert | 2000-09-05 |
| 6003757 | Apparatus for transferring solder bumps and method of using | Guy D. Beaumont, Guy Paul Brouillette, Peter A. Gruber | 1999-12-21 |
| 5897336 | Direct chip attach for low alpha emission interconnect system | Guy Paul Brouillette, Michael Liehr, William T. Motsiff, Judith Marie Roldan, Carlos J. Sambucetti +1 more | 1999-04-27 |
| 5775569 | Method for building interconnect structures by injection molded solder and structures built | Daniel G. Berger, Guy Paul Brouillette, Peter A. Gruber, Rajesh Shankerlal Patel, Stephen Roux +2 more | 1998-07-07 |
| 5202943 | Optoelectronic assembly with alignment member | Gary R. Carden, Eric M. Foster, William W. Vetter | 1993-04-13 |