Issued Patents All Time
Showing 25 most recent of 139 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12121368 | Embedded oral sensor platform | Rajeev Narayanan, Jeffrey L. Rogers | 2024-10-22 |
| 12014816 | Multi-sensor platform for health monitoring | John U. Knickerbocker, Qianwen Chen, Leanna Pancoast | 2024-06-18 |
| 11876233 | Thin film battery stacking | John U. Knickerbocker, Qianwen Chen | 2024-01-16 |
| 11850068 | Modular sensing unit | Rajeev Narayanan, Katsuyuki Sakuma | 2023-12-26 |
| 11810893 | Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection | William E. Bernier, John U. Knickerbocker, Son K. Tran, Mario J. Interrante | 2023-11-07 |
| 11710669 | Precision thin electronics handling integration | John U. Knickerbocker, Qianwen Chen, Joshua M. Rubin, Arvind Kumar | 2023-07-25 |
| 11696683 | Medical device system | Bo Wen, Jeffrey L. Rogers, Duixian Liu | 2023-07-11 |
| 11685580 | Medication counterfeit detection | Rajeev Narayanan | 2023-06-27 |
| 11666269 | Sleeping mask methods and panels with integrated sensors | Rajeev Narayanan, Jenna Reinen, Jeffrey L. Rogers | 2023-06-06 |
| 11587860 | Method of forming thin die stack assemblies | John U. Knickerbocker, Raymond R. Horton, Joana Sofia Branquinho Teresa Maria | 2023-02-21 |
| 11574835 | Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding | Jeffrey D. Gelorme, John U. Knickerbocker | 2023-02-07 |
| 11539080 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, John U. Knickerbocker | 2022-12-27 |
| 11539081 | Miniaturized electronics package with patterned thin film solid state battery | Qianwen Chen, John U. Knickerbocker | 2022-12-27 |
| 11539088 | Ultra-thin microbattery packaging and handling | Leanna Pancoast, Jae-Woong Nah, John U. Knickerbocker | 2022-12-27 |
| 11522243 | Hermetic packaging of a micro-battery device | Qianwen Chen, Jae-Woong Nah, Leanna Pancoast, John U. Knickerbocker | 2022-12-06 |
| 11509584 | Routing method, related device, and system | Shihai Hu, Peng Ma | 2022-11-22 |
| 11424152 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang | 2022-08-23 |
| 11411272 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-08-09 |
| 11362382 | Simplified hermetic packaging of a micro-battery | Paul S. Andry, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more | 2022-06-14 |
| 11348833 | IR assisted fan-out wafer level packaging using silicon handler | Jeffrey D. Gelorme, John U. Knickerbocker | 2022-05-31 |
| 11342108 | Stackable near-field communications antennas | Bo Wen, Rajeev Narayanan | 2022-05-24 |
| 11222862 | High speed handling of ultra-small chips by selective laser bonding and debonding | Qianwen Chen, Russell A. Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah +1 more | 2022-01-11 |
| 11201138 | Wafer level integration including design/co-design, structure process, equipment stress management and thermal management | Li-Wen Hung, John U. Knickerbocker, Jae-Woong Nah | 2021-12-14 |
| 11171374 | Thin film solid-state microbattery packaging | Qianwen Chen, John U. Knickerbocker, Bo Wen | 2021-11-09 |
| 11121005 | Handler bonding and debonding for semiconductor dies | Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Tsang Yang | 2021-09-14 |