| 12455227 |
Enclosed, multi-chamber metering and mixing system used for urinalysis |
Vince Siu, Bo Wen, Kun-Lin Hsieh |
2025-10-28 |
|
| 12121368 |
Embedded oral sensor platform |
Rajeev Narayanan, Jeffrey L. Rogers |
2024-10-22 |
$22,450,000 |
| 12014816 |
Multi-sensor platform for health monitoring |
John U. Knickerbocker, Qianwen Chen, Leanna Pancoast |
2024-06-18 |
$16,708,000 |
| 11876233 |
Thin film battery stacking |
John U. Knickerbocker, Qianwen Chen |
2024-01-16 |
$9,068,000 |
| 11850068 |
Modular sensing unit |
Rajeev Narayanan, Katsuyuki Sakuma |
2023-12-26 |
$6,691,000 |
| 11810893 |
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection |
William E. Bernier, John U. Knickerbocker, Son K. Tran, Mario J. Interrante |
2023-11-07 |
$6,695,000 |
| 11710669 |
Precision thin electronics handling integration |
John U. Knickerbocker, Qianwen Chen, Joshua M. Rubin, Arvind Kumar |
2023-07-25 |
$11,323,000 |
| 11696683 |
Medical device system |
Bo Wen, Jeffrey L. Rogers, Duixian Liu |
2023-07-11 |
$24,707,000 |
| 11685580 |
Medication counterfeit detection |
Rajeev Narayanan |
2023-06-27 |
$4,778,000 |
| 11666269 |
Sleeping mask methods and panels with integrated sensors |
Rajeev Narayanan, Jenna Reinen, Jeffrey L. Rogers |
2023-06-06 |
$14,513,000 |
| 11587860 |
Method of forming thin die stack assemblies |
John U. Knickerbocker, Raymond R. Horton, Joana Sofia Branquinho Teresa Maria |
2023-02-21 |
$5,683,000 |
| 11574835 |
Thermoplastic temporary adhesive for silicon handler with infra-red laser wafer de-bonding |
Jeffrey D. Gelorme, John U. Knickerbocker |
2023-02-07 |
$6,435,000 |
| 11539088 |
Ultra-thin microbattery packaging and handling |
Leanna Pancoast, Jae-Woong Nah, John U. Knickerbocker |
2022-12-27 |
$9,721,000 |
| 11539080 |
Miniaturized electronics package with patterned thin film solid state battery |
Qianwen Chen, John U. Knickerbocker |
2022-12-27 |
$9,721,000 |
| 11539081 |
Miniaturized electronics package with patterned thin film solid state battery |
Qianwen Chen, John U. Knickerbocker |
2022-12-27 |
$9,721,000 |
| 11522243 |
Hermetic packaging of a micro-battery device |
Qianwen Chen, Jae-Woong Nah, Leanna Pancoast, John U. Knickerbocker |
2022-12-06 |
$6,201,000 |
| 11509584 |
Routing method, related device, and system |
Shihai Hu, Peng Ma |
2022-11-22 |
|
| 11424152 |
Handler bonding and debonding for semiconductor dies |
Paul S. Andry, Jeffrey D. Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia K. Tsang |
2022-08-23 |
$8,523,000 |
| 11411272 |
Simplified hermetic packaging of a micro-battery |
Paul S. Andry, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more |
2022-08-09 |
$6,406,000 |
| 11362382 |
Simplified hermetic packaging of a micro-battery |
Paul S. Andry, John U. Knickerbocker, Yang Liu, Jae-Woong Nah, Adinath S. Narasgond +1 more |
2022-06-14 |
$8,092,000 |
| 11348833 |
IR assisted fan-out wafer level packaging using silicon handler |
Jeffrey D. Gelorme, John U. Knickerbocker |
2022-05-31 |
$8,769,000 |
| 11342108 |
Stackable near-field communications antennas |
Bo Wen, Rajeev Narayanan |
2022-05-24 |
$10,138,000 |
| 11222862 |
High speed handling of ultra-small chips by selective laser bonding and debonding |
Qianwen Chen, Russell A. Budd, Bo Wen, Li-Wen Hung, Jae-Woong Nah +1 more |
2022-01-11 |
$4,843,000 |
| 11201138 |
Wafer level integration including design/co-design, structure process, equipment stress management and thermal management |
Li-Wen Hung, John U. Knickerbocker, Jae-Woong Nah |
2021-12-14 |
$4,192,000 |
| 11171374 |
Thin film solid-state microbattery packaging |
Qianwen Chen, John U. Knickerbocker, Bo Wen |
2021-11-09 |
$5,376,000 |
