| 11810893 |
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection |
William E. Bernier, Bing Dang, John U. Knickerbocker, Son K. Tran |
2023-11-07 |
$6,695,000 |
| 11049841 |
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection |
William E. Bernier, Bing Dang, John U. Knickerbocker, Son K. Tran |
2021-06-29 |
$5,149,000 |
| 10903187 |
Selective area heating for 3D chip stack |
Katsuyuki Sakuma |
2021-01-26 |
$1,788,000 |
| 10262970 |
Selective area heating for 3D chip stack |
Katsuyuki Sakuma |
2019-04-16 |
$3,839,000 |
| 9860996 |
Selective area heating for 3D chip stack |
Katsuyuki Sakuma |
2018-01-02 |
$1,907,000 |
| 9431366 |
Selective area heating for 3D chip stack |
Katsuyuki Sakuma |
2016-08-30 |
$3,867,000 |
| 9373590 |
Integrated circuit bonding with interposer die |
Katsuyuki Sakuma |
2016-06-21 |
$3,815,000 |
| 9224712 |
3D bond and assembly process for severely bowed interposer die |
Marcus E. Interrante, Katsuyuki Sakuma |
2015-12-29 |
$4,224,000 |
| 9105629 |
Selective area heating for 3D chip stack |
Katsuyuki Sakuma |
2015-08-11 |
$2,160,000 |
| 9059241 |
3D assembly for interposer bow |
Katsuyuki Sakuma |
2015-06-16 |
$2,098,000 |
| 8689437 |
Method for forming integrated circuit assembly |
Bing Dang, David Danovitch, John U. Knickerbocker, Michael J. Shapiro, Van Thanh Truong |
2014-04-08 |
$7,562,000 |
| 8614512 |
Solder ball contact susceptible to lower stress |
Luc Guerin, Michael J. Shapiro, Thuy L. Tran-Quinn, Van Thanh Truong |
2013-12-24 |
$7,453,000 |
| 8487447 |
Semiconductor structure having offset passivation to reduce electromigration |
Gary LaFontant, Michael J. Shapiro, Thomas A. Wassick, Bucknell C. Webb |
2013-07-16 |
$5,283,000 |
| 8383505 |
Solder ball contact susceptible to lower stress |
Luc Guerin, Michael J. Shapiro, Thuy L. Tran-Quinn, Van Thanh Truong |
2013-02-26 |
$4,239,000 |
| 7781232 |
Method to recover underfilled modules by selective removal of discrete components |
Charles L. Arvin, Benjamin V. Fasano, Glenn A. Pomerantz |
2010-08-24 |
$3,306,000 |
| 6917113 |
Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly |
Mukta G. Farooq |
2005-07-12 |
$9,006,000 |
| 6892925 |
Solder hierarchy for lead free solder joint |
Mukta G. Farooq, William E. Sablinski |
2005-05-17 |
$7,073,000 |
| 6854636 |
Structure and method for lead free solder electronic package interconnections |
Mukta G. Farooq, William E. Sablinski |
2005-02-15 |
$11,729,000 |
| 6827505 |
Optoelectronic package structure and process for planar passive optical and optoelectronic devices |
Subhash L. Shinde, L. Wynn Herron, How T. Lin, Steven P. Ostrander, Sudipta K. Ray +2 more |
2004-12-07 |
$6,343,000 |
| 6762119 |
Method of preventing solder wetting in an optical device using diffusion of Cr |
Sudipta K. Ray, Mitchell S. Cohen, Lester W. Herron, Thomas E. Lombardi, Subhash L. Shinde |
2004-07-13 |
$8,966,000 |
| 6740959 |
EMI shielding for semiconductor chip carriers |
David J. Alcoe, Jeffrey T. Coffin, Michael A. Gaynes, Harvey C. Hamel, Brenda Peterson +6 more |
2004-05-25 |
$11,301,000 |
| 6574859 |
Interconnection process for module assembly and rework |
Shaji Farooq, Sudipta K. Ray, William E. Sablinski |
2003-06-10 |
$13,477,000 |
| 6532654 |
Method of forming an electrical connector |
Luc Guerin, Mark J. LaPlante, David C. Long, Gregory B. Martin, Thomas P. Moyer +2 more |
2003-03-18 |
$13,080,000 |
| 6518674 |
Temporary attach article and method for temporary attach of devices to a substrate |
Thomas E. Lombardi, Frank L. Pompeo, William E. Sablinski |
2003-02-11 |
$11,665,000 |
| 6497357 |
Apparatus and method for removing interconnections |
Raymond A. Jackson, Scott A. Bradley, Stephen A. DeLaurentis, David C. Linnell |
2002-12-24 |
$23,154,000 |
