Issued Patents All Time
Showing 25 most recent of 49 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9190392 | Three-dimensional stacked structured ASIC devices and methods of fabrication thereof | John Teifel, Richard S. Flores, Robert L. Jarecki, Jr., Todd Bauer | 2015-11-17 |
| 8913856 | Manufacturable optical connection assemblies | Lawrence Jacobowitz, John U. Knickerbocker, Ronald P. Luijten | 2014-12-16 |
| 8907439 | Focal plane array with modular pixel array components for scalability | Randolph R. Kay, David V. Campbell, Jeffrey L. Rienstra, Darwin K. Serkland, Michael Lowell Holmes +4 more | 2014-12-09 |
| 8089133 | Optical assemblies for transmitting and manipulating optical beams | Dinesh Gupta, Brenda Peterson, Mark V. Pierson, Eugen Schenfeld | 2012-01-03 |
| 7767575 | Forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quinn, William E. Sablinski +3 more | 2010-08-03 |
| 7544527 | Method and apparatus for providing optoelectronic communication with an electronic device | Alan F. Benner, How T. Lin, Frank L. Pompeo | 2009-06-09 |
| 7473997 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon, William E. Sablinski +3 more | 2009-01-06 |
| 7245022 | Semiconductor module with improved interposer structure and method for forming the same | Mukta G. Farooq, John U. Knickerbocker, Frank L. Pompeo | 2007-07-17 |
| 7128472 | Method and apparatus for providing optoelectronic communication with an electronic device | Alan F. Benner, Evan G. Colgan, How T. Lin, John Harold Magerlein, Frank L. Pompeo +1 more | 2006-10-31 |
| 7084496 | Method and apparatus for providing optoelectronic communication with an electronic device | Alan F. Benner, How T. Lin, Frank L. Pompeo | 2006-08-01 |
| 6995084 | Method for forming robust solder interconnect structures by reducing effects of seed layer underetching | Kamalesh K. Srivastava, Tien-Jen Cheng, Sarah H. Knickerbocker, Roger A. Quon, William E. Sablinski +3 more | 2006-02-07 |
| 6836015 | Optical assemblies for transmitting and manipulating optical beams | Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Steven P. Ostrander, Brenda Peterson +2 more | 2004-12-28 |
| 6827505 | Optoelectronic package structure and process for planar passive optical and optoelectronic devices | L. Wynn Herron, Mario J. Interrante, How T. Lin, Steven P. Ostrander, Sudipta K. Ray +2 more | 2004-12-07 |
| 6817776 | Method of bonding optical fibers and optical fiber assembly | Evan G. Colgan, Robert W. Law | 2004-11-16 |
| 6793407 | Manufacturable optical connection assemblies | Lawrence Jacobowitz, John U. Knickerbocker, Ronald P. Luijten | 2004-09-21 |
| 6762119 | Method of preventing solder wetting in an optical device using diffusion of Cr | Sudipta K. Ray, Mitchell S. Cohen, Lester W. Herron, Mario J. Interrante, Thomas E. Lombardi | 2004-07-13 |
| 6652956 | X-ray printing personalization technique | Lawrence A. Clevenger, David B. Goland, Louis L. Hsu, Joseph F. Shepard, Jr. | 2003-11-25 |
| 6638681 | X-ray printing personalization technique | Lawrence A. Clevenger, David B. Goland, Louis L. Hsu, Joseph F. Shepard, Jr. | 2003-10-28 |
| 6413339 | Low temperature sintering of ferrite materials | Govindarajan Natarajan, Jon A. Casey, Martin Klepeis, John U. Knickerbocker, Srinivasa S. N. Reddy +1 more | 2002-07-02 |
| 6373133 | Multi-chip module and heat-sink cap combination | Giulio DiGiacomo, Stephen S. Drofitz, Jr., David L. Edwards, Larry D. Gross, Sushumna Iruvanti +4 more | 2002-04-16 |
| 6352014 | Method for making punches using multi-layer ceramic technology | David B. Goland, David C. Long, John U. Knickerbocker | 2002-03-05 |
| 6306528 | Method for the controlling of certain second phases in aluminum nitride | Richard A. Bates, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +4 more | 2001-10-23 |
| 6292367 | Thermally efficient semiconductor chip | Kamal K. Sikka, John U. Knickerbocker | 2001-09-18 |
| 6291272 | Structure and process for making substrate packages for high frequency application | Ajay P. Giri, John U. Knickerbocker, David C. Long, Lisa M. Studzinski, Rao V. Vallabhaneni | 2001-09-18 |
| 6262390 | Repair process for aluminum nitride substrates | David B. Goland, Mark J. LaPlante, David C. Long, Dale Curtis McHerron, Krishna G. Sachdev | 2001-07-17 |