Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6974358 | Discrete magnets in dielectric forming metal/ceramic laminate and process thereof | Govindarajan Natarajan, John U. Knickerbocker, Srinivasa S. N. Reddy | 2005-12-13 |
| 6955777 | Method of forming a plate for dispensing chemicals | Govindarajan Natarajan, Umar M. Ahmad, Raschid J. Bezama, James N. Humenik, John U. Knickerbocker | 2005-10-18 |
| 6653776 | Discrete magnets in dielectric forming metal/ceramic laminate and process thereof | Govindarajan Natarajan, John U. Knickerbocker, Srinivasa S. N. Reddy | 2003-11-25 |
| 6494758 | Process of forming metal/ferrite laminated magnet | Govindarajan Natarajan, John U. Knickerbocker, Srinivasa S. N. Reddy | 2002-12-17 |
| 6376054 | Surface metallization structure for multiple chip test and burn-in | Scott I. Langenthal, Thomas E. Lombardi, Richard F. Indyk, John U. Knickerbocker, Srinivasa S. N. Reddy +2 more | 2002-04-23 |
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2002-03-19 |
| 6319829 | Enhanced interconnection to ceramic substrates | Robert W. Pasco, Srinivasa S. N. Reddy | 2001-11-20 |
| 6312791 | Multilayer ceramic substrate with anchored pad | Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Sundar M. Kamath, Scott I. Langenthal +1 more | 2001-11-06 |
| 6291272 | Structure and process for making substrate packages for high frequency application | Ajay P. Giri, John U. Knickerbocker, David C. Long, Subhash L. Shinde, Lisa M. Studzinski | 2001-09-18 |
| 6238741 | Single mask screening process | James M. Blazick, Michael E. Cropp, James N. Humenik, Gerald H. Leino, Jawahar P. Nayak +5 more | 2001-05-29 |
| 6199747 | High temperature refractory joining paste | Michael A. Cohn, Joseph P. DeGeorge | 2001-03-13 |
| 6187418 | Multilayer ceramic substrate with anchored pad | Benjamin V. Fasano, David H. Gabriels, Richard F. Indyk, Sundar M. Kamath, Scott I. Langenthal +1 more | 2001-02-13 |
| 6124041 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 2000-09-26 |
| 6117367 | Pastes for improved substrate dimensional control | Raschid J. Bezama, Michael A. Cohn, Benjamin V. Fasano, Gregory M. Johnson, Robert A. Rita +1 more | 2000-09-12 |
| 6096565 | Multi-layer glass ceramic module with superconductor wiring | David B. Goland, Richard A. Shelleman, Subhash L. Shinde, Lisa M. Studzinski | 2000-08-01 |
| 6002951 | Multi-layer ceramic substrate having high TC superconductor circuitry | David B. Goland, Richard A. Shelleman, Subhash L. Shinde, Lisa M. Studzinski | 1999-12-14 |
| 5925443 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias | Farid Youssif Aoude, Lawrence D. David, Renuka S. Divakaruni, Shaji Farooq, Lester W. Herron +6 more | 1999-07-20 |
| 5787578 | Method of selectively depositing a metallic layer on a ceramic substrate | Shaji Farooq, Suryanarayana Kaja, John U. Knickerbocker, Brenda Peterson, Srinivasan N. Reddy +1 more | 1998-08-04 |
| 5763093 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +7 more | 1998-06-09 |
| 5682589 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +7 more | 1997-10-28 |
| 5552107 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +7 more | 1996-09-03 |
| 5552232 | Aluminum nitride body having graded metallurgy | Jon A. Casey, Carla N. Cordero, Benjamin V. Fasano, David B. Goland, Robert Hannon +7 more | 1996-09-03 |
| 5525761 | Copper-based paste containing refractory metal additions for densification control | Lawrence D. David, Shaji Farooq, Anthony Mastreani, Srinivasa S. N. Reddy | 1996-06-11 |
| 5512711 | Copper-based paste containing refractory metal additions for densification control | Lawrence D. David, Shaji Farooq, Anthony Mastreani, Srinivasa S. N. Reddy | 1996-04-30 |
| 5337475 | Process for producing ceramic circuit structures having conductive vias | Farid Youssif Aoude, Emanuel I. Cooper, Peter Richard Duncombe, Shaji Farooq, Edward A. Giess +12 more | 1994-08-16 |