| 8089133 |
Optical assemblies for transmitting and manipulating optical beams |
Dinesh Gupta, Mark V. Pierson, Eugen Schenfeld, Subhash L. Shinde |
2012-01-03 |
| 7278207 |
Method of making an electronic package |
Lisa J. Jimarez, Miguel A. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Charles H. Perry |
2007-10-09 |
| 6961995 |
Method of making an electronic package |
Lisa J. Jimarez, Miguel A. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Charles H. Perry |
2005-11-08 |
| 6836015 |
Optical assemblies for transmitting and manipulating optical beams |
Monty M. Denneau, Dinesh Gupta, Lisa J. Jimarez, Steven P. Ostrander, Mark V. Pierson +2 more |
2004-12-28 |
| 6740959 |
EMI shielding for semiconductor chip carriers |
David J. Alcoe, Jeffrey T. Coffin, Michael A. Gaynes, Harvey C. Hamel, Mario J. Interrante +6 more |
2004-05-25 |
| 6595136 |
Method for displacing an article during screening |
Ralph R. Comulada, Jr., Robert Albert Meyen, Keith C. O'Neil, Kurt A. Smith |
2003-07-22 |
| 6543347 |
Apparatus for displacing an article during screening |
Ralph R. Comulada, Jr., Robert Albert Meyen, Keith C. O'Neil, Thomas Ramundo, Kurt A. Smith |
2003-04-08 |
| 6486415 |
Compliant layer for encapsulated columns |
Lisa J. Jimarez, Miguel A. Jimarez, Voya R. Markovich, Cynthia S. Milkovich, Charles H. Perry |
2002-11-26 |
| 6475555 |
Process for screening features on an electronic substrate with a low viscosity paste |
Jon A. Casey, Dinesh Gupta, Lester W. Herron, John U. Knickerbocker, David C. Long +2 more |
2002-11-05 |
| 6458623 |
Conductive adhesive interconnection with insulating polymer carrier |
Lewis S. Goldmann, Mario J. Interrante, Raymond A. Jackson, Amy B. Ostrander, Charles H. Perry |
2002-10-01 |
| 6429388 |
High density column grid array connections and method thereof |
Mario J. Interrante, Sudipta K. Ray, William E. Sablinski, Amit K. Sarkhel |
2002-08-06 |
| 6402866 |
Powdered metallic sheet method for deposition of substrate conductors |
Jon A. Casey, John U. Knickerbocker, David C. Long |
2002-06-11 |
| 6341417 |
Pre-patterned substrate layers for being personalized as needed |
Dinesh Gupta, Lester W. Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak +1 more |
2002-01-29 |
| 6017025 |
Component retainer |
James G. Balz, Mark J. LaPlante, David C. Long, Donald R. Wall |
2000-01-25 |
| 5996985 |
Component retainer |
James G. Balz, Mark J. LaPlante, David C. Long, Donald R. Wall |
1999-12-07 |
| 5927193 |
Process for via fill |
James G. Balz, Cynthia J. Calli, Jon A. Casey, David C. Long, Daniel S. Mackin +2 more |
1999-07-27 |
| 5846361 |
Lamination process for producing non-planar substrates |
Benjamin V. Fasano, Mark J. LaPlante, David C. Long, Keith C. O'Neil, Glenn A. Pomerantz +1 more |
1998-12-08 |
| 5808268 |
Method for marking substrates |
James G. Balz, Mark J. LaPlante, David C. Long |
1998-09-15 |
| 5787578 |
Method of selectively depositing a metallic layer on a ceramic substrate |
Shaji Farooq, Suryanarayana Kaja, John U. Knickerbocker, Srinivasan N. Reddy, Rao V. Vallabhaneni +1 more |
1998-08-04 |
| 5645673 |
Lamination process for producing non-planar substrates |
Benjamin V. Fasano, Mark J. LaPlante, David C. Long, Keith C. O'Neil, Glenn A. Pomerantz +1 more |
1997-07-08 |
