Issued Patents All Time
Showing 25 most recent of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462512 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf +2 more | 2022-10-04 |
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Charles L. Arvin +5 more | 2021-11-16 |
| 11056418 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka | 2021-07-06 |
| 11049789 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka | 2021-06-29 |
| 11049844 | Semiconductor wafer having trenches with varied dimensions for multi-chip modules | Ravi K. Bonam, Mukta G. Farooq, James J. Kelly, Kamal K. Sikka, Joshua M. Rubin | 2021-06-29 |
| 10943883 | Planar wafer level fan-out of multi-chip modules having different size chips | Ravi K. Bonam, Mukta G. Farooq, James J. Kelly | 2021-03-09 |
| 10937764 | Three-dimensional microelectronic package with embedded cooling channels | Kamal K. Sikka, Fee Li Lie, Kevin R. Winstel, Ravi K. Bonam, Iqbal Rashid Saraf +2 more | 2021-03-02 |
| 10580738 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Charles L. Arvin +5 more | 2020-03-03 |
| 10553516 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka | 2020-02-04 |
| 10553522 | Semiconductor microcooler | Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb, Fee Li Lie, Kamal K. Sikka | 2020-02-04 |
| 10490481 | Copper microcooler structure and fabrication | Fee Li Lie, Kamal K. Sikka, Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb | 2019-11-26 |
| 10490480 | Copper microcooler structure and fabrication | Fee Li Lie, Kamal K. Sikka, Donald F. Canaperi, Daniel A. Corliss, Dario L. Goldfarb | 2019-11-26 |
| 8089133 | Optical assemblies for transmitting and manipulating optical beams | Brenda Peterson, Mark V. Pierson, Eugen Schenfeld, Subhash L. Shinde | 2012-01-03 |
| 6836015 | Optical assemblies for transmitting and manipulating optical beams | Monty M. Denneau, Lisa J. Jimarez, Steven P. Ostrander, Brenda Peterson, Mark V. Pierson +2 more | 2004-12-28 |
| 6713686 | Apparatus and method for repairing electronic packages | Wiren D. Becker, Sudipta K. Ray, Robert A. Rita, Herbert I. Stoller, Kathleen M. Wiley | 2004-03-30 |
| 6662718 | Screening mask having a stress-relieving area | Evelyn Barrington, Jeffrey A. Brody, Harry D. Cox, Lorraine Di Piero-Simmonds, John J. Garant +7 more | 2003-12-16 |
| 6631675 | Screening method for double pass screening | Jeffrey A. Brody, Harry D. Cox, John J. Garant, Dale W. Snowdon | 2003-10-14 |
| 6475555 | Process for screening features on an electronic substrate with a low viscosity paste | Jon A. Casey, Lester W. Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak +2 more | 2002-11-05 |
| 6341417 | Pre-patterned substrate layers for being personalized as needed | Lester W. Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Keith C. O'Neil +1 more | 2002-01-29 |
| 6245185 | Method of making a multilayer ceramic product with thin layers | Raschid J. Bezama, Govindarajan Natarajan | 2001-06-12 |
| 6231707 | Method of forming a multilayer ceramic substrate with max-punched vias | L. Wynn Herron, John U. Knickerbocker, David C. Long, Jawahar P. Nayak, Robert A. Rita | 2001-05-15 |
| 6005228 | Electrical heating systems | Michael Dickens, Albert J. Highe | 1999-12-21 |
| 5655209 | Multilayer ceramic substrates having internal capacitor, and process for producing same | Jon A. Casey, John P. Gauci, Robert A. Rita, Robert J. Sullivan | 1997-08-05 |
| 5629216 | Method for producing semiconductor wafers with low light scattering anomalies | Witawat Wijaranakula, Sandra A. Archer | 1997-05-13 |
| 5601672 | Method for making ceramic substrates from thin and thick ceramic greensheets | Jon A. Casey, James Wylder | 1997-02-11 |